Chapter 41. Mechanical and Physical Properties of Cu2O−xCu Cermet

  1. Rajan Tandon,
  2. Andrew Wereszczak and
  3. Edgar Lara-Curzio
  1. N. Xie,
  2. W. Z. Shao,
  3. L. Zhen and
  4. L. C. Feng

Published Online: 27 MAR 2008

DOI: 10.1002/9780470291313.ch41

Mechanical Properties and Performance of Engineering Ceramics II: Ceramic Engineering and Science Proceedings, Volume 27, Issue 2

Mechanical Properties and Performance of Engineering Ceramics II: Ceramic Engineering and Science Proceedings, Volume 27, Issue 2

How to Cite

Xie, N., Shao, W. Z., Zhen, L. and Feng, L. C. (2006) Mechanical and Physical Properties of Cu2O−xCu Cermet, in Mechanical Properties and Performance of Engineering Ceramics II: Ceramic Engineering and Science Proceedings, Volume 27, Issue 2 (eds R. Tandon, A. Wereszczak and E. Lara-Curzio), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470291313.ch41

Author Information

  1. School of Materials Science and Engineering P. O. Box 433, Harbin Institute of Technology Harbin 150001, P.R. China

Publication History

  1. Published Online: 27 MAR 2008
  2. Published Print: 1 JAN 2006

ISBN Information

Print ISBN: 9780470080528

Online ISBN: 9780470291313

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Keywords:

  • aluminum;
  • netzsch;
  • compressive;
  • phenomenon;
  • conductivity

Summary

Cu2O/xCu (x=0∼25wt.%) cermets as novel inert anode materials for aluminum production were prepared via hot pressing technology with different processing parameters. The compressive strength, thermal shock resistance, thermal expansion coefficient, thermal conductivity, and dc electrical conductivity at room temperature of Cu2O / xCu cermets were tested. The dependence of dc electrical conductivity on temperature of Cu2O/xCu cermets with Cu content lower and higher than the percolation threshold was investigated as well. The thermal expansion coefficient, the compressive strength, the thermal conductivity and the electrical conductivity of Cu2O / xCu cermets increase with the Cu content, however, the thermal shock resistance decreases with the increase of Cu content. High temperature electrical conductivity measurements showed that with the increase of temperature, the electrical conductivity of the cermet increases when the Cu content is lower than the percolation threshold, while decreases when the Cu content is higher than the percolation threshold. The microstructure analysis suggests that the electrical conductivity of Cu2O / xCu cermets depends on the shape, size, and distribution of Cu phase.