Chapter 16. Brazing of Heat Sink Attachments for New Electronic Ceramic Substrates

  1. J. P. Singh
  1. Wendy B Hanson,
  2. John A Fernie and
  3. Norman R Stockham

Published Online: 26 MAR 2008

DOI: 10.1002/9780470294444.ch16

Proceedings of the 21st Annual Conference on Composites, Advanced Ceramics, Materials, and Structures - B: Ceramic Engineering and Science Proceedings, Volume 18, Issue 4

Proceedings of the 21st Annual Conference on Composites, Advanced Ceramics, Materials, and Structures - B: Ceramic Engineering and Science Proceedings, Volume 18, Issue 4

How to Cite

Hanson, W. B., Fernie, J. A. and Stockham, N. R. (1997) Brazing of Heat Sink Attachments for New Electronic Ceramic Substrates, in Proceedings of the 21st Annual Conference on Composites, Advanced Ceramics, Materials, and Structures - B: Ceramic Engineering and Science Proceedings, Volume 18, Issue 4 (ed J. P. Singh), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470294444.ch16

Author Information

  1. TWI, Abington Hall, Abington, Cambridge, CB1 6AL United Kingdom

Publication History

  1. Published Online: 26 MAR 2008
  2. Published Print: 1 JAN 1997

ISBN Information

Print ISBN: 9780470375532

Online ISBN: 9780470294444

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Keywords:

  • capabilities;
  • conjunction;
  • thermal transients;
  • semiconductor;
  • thermal expansion

Summary

Alumina has been the dominant material for electronic ceramic substrates. However, its selection has always been a compromise of properties, cost and availability. Advances in technology now demand materials beyond the capabilities of alumina. Materials are required with superior thermal conductivity, mechanical strength and closer thermal expansion to silicon. This paper reviews potential alternative materials and discusses how brazing technology would allow their incorporation into power devices and high density packaging.