Chapter 6. Tensile Creep Performance of a Developmental, In-Situ Reinforced Silicon Nitride

  1. J. P. Singh
  1. A. A. Wereszczak1,
  2. T. P. Kirkland1,
  3. H.-T. Lin1,
  4. M. K. Ferber1,
  5. C.-W. Li2 and
  6. J. A. Goldacker2

Published Online: 26 MAR 2008

DOI: 10.1002/9780470294444.ch6

Proceedings of the 21st Annual Conference on Composites, Advanced Ceramics, Materials, and Structures - B: Ceramic Engineering and Science Proceedings, Volume 18, Issue 4

Proceedings of the 21st Annual Conference on Composites, Advanced Ceramics, Materials, and Structures - B: Ceramic Engineering and Science Proceedings, Volume 18, Issue 4

How to Cite

Wereszczak, A. A., Kirkland, T. P., Lin, H.-T., Ferber, M. K., Li, C.-W. and Goldacker, J. A. (1997) Tensile Creep Performance of a Developmental, In-Situ Reinforced Silicon Nitride, in Proceedings of the 21st Annual Conference on Composites, Advanced Ceramics, Materials, and Structures - B: Ceramic Engineering and Science Proceedings, Volume 18, Issue 4 (ed J. P. Singh), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470294444.ch6

Author Information

  1. 1

    High Temperature Materials Laboratory, Oak Ridge National Laboratory, Oak Ridge, TN 37831-6069

  2. 2

    Allied Signal, Inc. Morristown, NJ 07962

Publication History

  1. Published Online: 26 MAR 2008
  2. Published Print: 1 JAN 1997

ISBN Information

Print ISBN: 9780470375532

Online ISBN: 9780470294444

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