Chapter 71. Efficient Grinding of Silicon Nitride

  1. J. P. Singh
  1. Y. Nagano and
  2. M. Mizuno

Published Online: 26 MAR 2008

DOI: 10.1002/9780470294444.ch71

Proceedings of the 21st Annual Conference on Composites, Advanced Ceramics, Materials, and Structures - B: Ceramic Engineering and Science Proceedings, Volume 18, Issue 4

Proceedings of the 21st Annual Conference on Composites, Advanced Ceramics, Materials, and Structures - B: Ceramic Engineering and Science Proceedings, Volume 18, Issue 4

How to Cite

Nagano, Y. and Mizuno, M. (1997) Efficient Grinding of Silicon Nitride, in Proceedings of the 21st Annual Conference on Composites, Advanced Ceramics, Materials, and Structures - B: Ceramic Engineering and Science Proceedings, Volume 18, Issue 4 (ed J. P. Singh), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470294444.ch71

Author Information

  1. Japan Fine Ceramics Center, 2–4–1 Mutsuno Atsuta-ku Nagoya, 456, Japan

Publication History

  1. Published Online: 26 MAR 2008
  2. Published Print: 1 JAN 1997

ISBN Information

Print ISBN: 9780470375532

Online ISBN: 9780470294444

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Keywords:

  • grinding force;
  • flexural strength;
  • optimum machining conditions;
  • inherent strength;
  • transversely

Summary

Grinding conditions for wheels with different grain size, grinding force and depth of cut and the effects of grinding on flexural strength of the silicon nitride were studied for cost effective grinding. The grinding force was changed with number of grinding passes under the same down feed rate. Flexural strengths of the specimens after grinding at coarse conditions were reduced by 35% in comparison with those of polished specimens. Grinding with fine grain recovered the strength with increasing removal of machining damaged layer. The strength reached more than 10% higher than that of polished specimen.