Chapter 19. Computational Analysis of Residual Stress in Ceramics Having Heterogeneous Microstructure

  1. Don Bray
  1. Yoshihisa Sakaida1,
  2. Akira Okada1,
  3. Keisuke Tanaka2,
  4. Yoshiyuki Yasutomi3 and
  5. Hiroshi Kawamoto3

Published Online: 23 MAR 2010

DOI: 10.1002/9780470294499.ch19

22nd Annual Conference on Composites, Advanced Ceramics, Materials, and Structures: B: Ceramic Engineering and Science Proceedings, Volume 19, Issue 4

22nd Annual Conference on Composites, Advanced Ceramics, Materials, and Structures: B: Ceramic Engineering and Science Proceedings, Volume 19, Issue 4

How to Cite

Sakaida, Y., Okada, A., Tanaka, K., Yasutomi, Y. and Kawamoto, H. (1998) Computational Analysis of Residual Stress in Ceramics Having Heterogeneous Microstructure, in 22nd Annual Conference on Composites, Advanced Ceramics, Materials, and Structures: B: Ceramic Engineering and Science Proceedings, Volume 19, Issue 4 (ed D. Bray), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470294499.ch19

Author Information

  1. 1

    Research and Development Laboratory, Japan Fine Ceramics Center, 2–4–1 Mutsuno, Atsuta-ku, Nagoya, 456 Japan

  2. 2

    Faculty of Engineering, Nagoya University, Furo-cho, Chikusa-ku, Nagoya, 464–01 Japan

  3. 3

    Research and Development Laboratory, Japan Fine Ceramics Center

Publication History

  1. Published Online: 23 MAR 2010
  2. Published Print: 1 JAN 1998

ISBN Information

Print ISBN: 9780470375594

Online ISBN: 9780470294499

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Keywords:

  • combustion;
  • atomized;
  • eliminates;
  • inspiration;
  • retention

Summary

Residual micro-stress fields of ceramics having heterogeneous microstructure were calculated by the finite element method. A microstructural model used for the calculation was composed of anisotropic grains having hexagonal or rhombohedral crystalline system and grain boundaries with a constant thickness. In order to calculate the local stress induced during the cooling stage of the sintering process, the crystallographic data of alumina were used as the anisotropic properties of the grain. The residual stress was built up by the difference of elastic stiffness constants and thermal expansion coefficients between neighboring grains. The maximum stress in the residual micro-stress field decreases with a decrease in Young's modulus and with an increase in the thickness of the grain boundary phase. The local stress in each grain rapidly changes in the vicinity of the grain boundary. The average local stress within grains is compressive in the case where the thermal expansion coefficient of the grain boundary phase is larger than that of the grain phase. The residual micro-stress field is controllable by changing the thickness, mechanical properties, or the thermal expansion coefficient of the grain boundary phase.