Chapter 19. Grain Growth and Tensile Strength of 3M Nextel 720™ After Thermal Exposure

  1. Ersan Ustundag and
  2. Gary Fischman
  1. R. S. Hay1,
  2. E. E. Boakye2,
  3. M. D. Petry2,
  4. Y. Berta3,
  5. K. Von Lehmden4 and
  6. J. Welch4

Published Online: 26 MAR 2008

DOI: 10.1002/9780470294567.ch19

23rd Annual Conference on Composites, Advanced Ceramics, Materials, and Structures : A: Ceramic Engineering and Science Proceedings, Volume 20, Issue 3

23rd Annual Conference on Composites, Advanced Ceramics, Materials, and Structures : A: Ceramic Engineering and Science Proceedings, Volume 20, Issue 3

How to Cite

Hay, R. S., Boakye, E. E., Petry, M. D., Berta, Y., Von Lehmden, K. and Welch, J. (1999) Grain Growth and Tensile Strength of 3M Nextel 720™ After Thermal Exposure, in 23rd Annual Conference on Composites, Advanced Ceramics, Materials, and Structures : A: Ceramic Engineering and Science Proceedings, Volume 20, Issue 3 (eds E. Ustundag and G. Fischman), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470294567.ch19

Author Information

  1. 1

    Air Force Research Lab, Materials Directorate WPAFB, OH 45433

  2. 2

    UES Inc. and Air Force Research Lab, Materials Directorate WPAFB, OH 45433

  3. 3

    Georgia Institute of Technology Atlanta, GA

  4. 4

    Wright State University Dayton, OH

Publication History

  1. Published Online: 26 MAR 2008
  2. Published Print: 1 JAN 1999

ISBN Information

Print ISBN: 9780470375631

Online ISBN: 9780470294567

SEARCH

Keywords:

  • tensile;
  • degradation;
  • oxidize;
  • crystal oxide;
  • polycrystalline

Summary

Tensile strength and grain growth of 3M Nextel 720™ fibers were measured after heat-treatment from 1000° to 1500°C for 20 minutes to 300 hours. Grain growth characteristics are discussed. Possible relationships between grain growth and fiber tensile strength are explored. Conditions under which tensile strength degradation was not related to grain growth are identified. Possible mechanisms for strength degradation are discussed.