Chapter 44. Active Metal Brazing of Various Types of Si3N4 to Cu and Cu-Alloy

  1. Ersan Ustundag and
  2. Gary Fischman
  1. Maiken Heim1,
  2. Donald G. Ulmer2 and
  3. Victor A. Greenhut1

Published Online: 26 MAR 2008

DOI: 10.1002/9780470294567.ch44

23rd Annual Conference on Composites, Advanced Ceramics, Materials, and Structures : A: Ceramic Engineering and Science Proceedings, Volume 20, Issue 3

23rd Annual Conference on Composites, Advanced Ceramics, Materials, and Structures : A: Ceramic Engineering and Science Proceedings, Volume 20, Issue 3

How to Cite

Heim, M., Ulmer, D. G. and Greenhut, V. A. (1999) Active Metal Brazing of Various Types of Si3N4 to Cu and Cu-Alloy, in 23rd Annual Conference on Composites, Advanced Ceramics, Materials, and Structures : A: Ceramic Engineering and Science Proceedings, Volume 20, Issue 3 (eds E. Ustundag and G. Fischman), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470294567.ch44

Author Information

  1. 1

    Rutgers—The State University of New Jersey Dept. of Ceramic and Materials Engineering 607 Taylor Rd., Piscataway, NJ 08854–8065

  2. 2

    The Boeing Company, Rocketdyne Propulsion & Power, 6633 Canoga Ave. MS PAM, P.O. Box 7922, Canoga Park, CA 91309-7922

Publication History

  1. Published Online: 26 MAR 2008
  2. Published Print: 1 JAN 1999

ISBN Information

Print ISBN: 9780470375631

Online ISBN: 9780470294567

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Keywords:

  • elevated;
  • ceramic;
  • sintering;
  • distribution;
  • protocols

Summary

Ceramic-metal bonds require high strength at elevated temperature for a number of technical applications. Si3N4 from three different suppliers (designated: A, B, C) were used in this work. The effect of supplier, ceramic surface finish, type of active metal braze and brazing temperature on the peel bond strength between Si3N4 and Cu or Cu-alloy were studied. Incusil ABA™ and Cusil ABA™ were the active metal braze alloys used. The highest average peel strength (307 N/cm) was obtained for polished samples of A-type Si3N4 bonded to copper alloy with Incusil ABA™ at 740°C. This strength value was twice that for the other two Si3N4 sources (B & C). Ground type-A Si3N4 also demonstrated a higher peel strength relative to ground samples of type-B, but all bonds were considerably weaker than for the polished finish. Type-C Si3N4 showed a higher peel strength for ground/re-sintered samples compared to polished material at temperatures ≥740°C. A few investigations were performed replacing Incusil ABA™ with Cusil ABA™. There was no significant increase in strength applying Cusil ABA™ as compared to Incusil ABA™. The various types (sources) of Si3N4 give very different peel strength when prepared and tested under the same conditions. It is believed, based upon prior bonding studies, that the differences in bond quality resulted from differences in minor chemistry—probably in the form of sintering aids and their distribution in the materials.