Chapter 46. Relationships Among Changes in Electrical Conductivity, Thermal Conductivity, Thermal Diffusivity, and Elastic Modulus for Microcracked Materials

  1. Ersan Ustundag and
  2. Gary Fischman
  1. E. D. Case

Published Online: 26 MAR 2008

DOI: 10.1002/9780470294567.ch46

23rd Annual Conference on Composites, Advanced Ceramics, Materials, and Structures : A: Ceramic Engineering and Science Proceedings, Volume 20, Issue 3

23rd Annual Conference on Composites, Advanced Ceramics, Materials, and Structures : A: Ceramic Engineering and Science Proceedings, Volume 20, Issue 3

How to Cite

Case, E. D. (1999) Relationships Among Changes in Electrical Conductivity, Thermal Conductivity, Thermal Diffusivity, and Elastic Modulus for Microcracked Materials, in 23rd Annual Conference on Composites, Advanced Ceramics, Materials, and Structures : A: Ceramic Engineering and Science Proceedings, Volume 20, Issue 3 (eds E. Ustundag and G. Fischman), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470294567.ch46

Author Information

  1. Materials Science and Mechanics Department Michigan State University East Lansing, MI 48824

Publication History

  1. Published Online: 26 MAR 2008
  2. Published Print: 1 JAN 1999

ISBN Information

Print ISBN: 9780470375631

Online ISBN: 9780470294567

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Keywords:

  • microcracking;
  • elastic modulus;
  • conductivity;
  • diffusivity;
  • thermal conductivity

Summary

Typically in the literature, studies of microcracking-induced property changes focus on a single physical property (such as the elastic modulus or thermal conductivity) as a function of microcrack damage. However, for a given body with a fixed microcrack damage state, many physical properties are affected simultaneously. As this paper will discuss, if one determines the microcrack-induced change in, say, elastic modulus or electrical conductivity, one can estimate, for the same body with the same microcrack damage state, the corresponding changes in the thermal diffusivity or thermal conductivity, for example.