Chapter 47. Fracture Behavior of High Thermal Conductive Aluminum Nitride

  1. Ersan Ustundag and
  2. Gary Fischman
  1. J. Tatami1,
  2. K. Komeya1,
  3. T. Meguro1,
  4. S. Iwasawa1 and
  5. M. Komatsu2

Published Online: 26 MAR 2008

DOI: 10.1002/9780470294567.ch47

23rd Annual Conference on Composites, Advanced Ceramics, Materials, and Structures : A: Ceramic Engineering and Science Proceedings, Volume 20, Issue 3

23rd Annual Conference on Composites, Advanced Ceramics, Materials, and Structures : A: Ceramic Engineering and Science Proceedings, Volume 20, Issue 3

How to Cite

Tatami, J., Komeya, K., Meguro, T., Iwasawa, S. and Komatsu, M. (1999) Fracture Behavior of High Thermal Conductive Aluminum Nitride, in 23rd Annual Conference on Composites, Advanced Ceramics, Materials, and Structures : A: Ceramic Engineering and Science Proceedings, Volume 20, Issue 3 (eds E. Ustundag and G. Fischman), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470294567.ch47

Author Information

  1. 1

    Yokohama National University 79–5 Tokiwadai, Hodogayaku Yokohama, 240–8501, Japan

  2. 2

    Toshiba Corporation 2–4 Suehirocho, Tsurumiku Yokohama, 230–0045, Japan

Publication History

  1. Published Online: 26 MAR 2008
  2. Published Print: 1 JAN 1999

ISBN Information

Print ISBN: 9780470375631

Online ISBN: 9780470294567

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