Chapter 76. Microstructure, Mechanical and Thermal Properties of Unidirectionally Alligned Silicon Nitride

  1. Todd Jessen and
  2. Ersan Ustundag
  1. Soo W. Lee1,
  2. Sang Yang Lee1,
  3. Yong Ho Choa2,
  4. Koichi Niihara2,
  5. Dong-Soo Park3 and
  6. Bernard J. Hockey4

Published Online: 28 MAR 2008

DOI: 10.1002/9780470294635.ch76

24th Annual Conference on Composites, Advanced Ceramics, Materials, and Structures: B: Ceramic Engineering and Science Proceedings, Volume 21, Issue 4

24th Annual Conference on Composites, Advanced Ceramics, Materials, and Structures: B: Ceramic Engineering and Science Proceedings, Volume 21, Issue 4

How to Cite

Lee, S. W., Lee, S. Y., Choa, Y. H., Niihara, K., Park, D.-S. and Hockey, B. J. (2000) Microstructure, Mechanical and Thermal Properties of Unidirectionally Alligned Silicon Nitride, in 24th Annual Conference on Composites, Advanced Ceramics, Materials, and Structures: B: Ceramic Engineering and Science Proceedings, Volume 21, Issue 4 (eds T. Jessen and E. Ustundag), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470294635.ch76

Author Information

  1. 1

    Department of Materials Engineering, SunMoon University, Asan, Korea

  2. 2

    ISIR SANKEN, Osaka University, 8–1 Mihogaoka, Ibaraki, Osaka, Japan

  3. 3

    Korea Institute o f Machinery and Materials Changwon, Korea

  4. 4

    National Institute of Standards and Technology Gaithersburg, MD, 20899, U.S.A.

Publication History

  1. Published Online: 28 MAR 2008
  2. Published Print: 1 JAN 2000

ISBN Information

Print ISBN: 9780470375693

Online ISBN: 9780470294635

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Keywords:

  • tape casting method;
  • gas pressure sintering technique;
  • thermal conductivity;
  • silicon nitride;
  • thermal conductivity measurement

Summary

β-Si3N4 whiskers were aligned unidirectionally among α-Si3N4 Si3N4 particles by the modified tape casting method and sintered by gas pressure sintering technique. The large elongated grains were grown unidirectionally with enclosing core structure. Mechanical properties (microhardness, fracture toughness), thermal conductivity, and tribological properties in Si3N4 whisker reinforced Si3N4 composites were investigated as a function of the amount of Si3N4 whisker. The fracture toughness of 10 wt% β-Si3N4 whiskers sample was 10 MPam1/2 in the perpendicular direction to the tape casting plane. Thermal conductivity increased with increasing the amount of β-Si3N4 whiskers. Thermal conductivity was strongly dependent upon the orientation of β-Si3N4 whiskers. TEM, EDX and XRD analyses were carried out to understand the effect of microstructure on these properties. Keywords: Silicon nitride, Si3N4whiskers, composites, thermal conductivity