Chapter 19. Tensile Creep in the Next Generation Silicon Nitride

  1. Mrityunjay Singh and
  2. Todd Jessen
  1. FrantiŠEk Lofaj1,
  2. Sheldon M. Wiederhorn1,
  3. Gabrielle G. Long1 and
  4. Pete R. Jemian2

Published Online: 26 MAR 2008

DOI: 10.1002/9780470294680.ch19

25th Annual Conference on Composites, Advanced Ceramics, Materials, and Structures: A: Ceramic Engineering and Science Proceedings, Volume 22, Issue 3

25th Annual Conference on Composites, Advanced Ceramics, Materials, and Structures: A: Ceramic Engineering and Science Proceedings, Volume 22, Issue 3

How to Cite

Lofaj, F., Wiederhorn, S. M., Long, G. G. and Jemian, P. R. (2001) Tensile Creep in the Next Generation Silicon Nitride, in 25th Annual Conference on Composites, Advanced Ceramics, Materials, and Structures: A: Ceramic Engineering and Science Proceedings, Volume 22, Issue 3 (eds M. Singh and T. Jessen), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470294680.ch19

Author Information

  1. 1

    National Institute of Standards and Technology MSEL Bldg. 223 Gaithersburg, MD 20899, USA

  2. 2

    University of Illinois at Urbana- Champaign\Argonne National Laboratory Argonne, IL 60439, USA

Publication History

  1. Published Online: 26 MAR 2008
  2. Published Print: 1 JAN 2001

ISBN Information

Print ISBN: 9780470375730

Online ISBN: 9780470294680

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