Chapter 67. C-Coupon Studies of Cmcs: Fracture Behavior and Microstructural Characterization

  1. Mrityunjay Singh and
  2. Todd Jessen
  1. Frances I. Hurwitz1,
  2. Anthony M. Calomino1,
  3. Terry R. Mccue2 and
  4. Ali Abdul-Aziz3

Published Online: 26 MAR 2008

DOI: 10.1002/9780470294680.ch67

25th Annual Conference on Composites, Advanced Ceramics, Materials, and Structures: A: Ceramic Engineering and Science Proceedings, Volume 22, Issue 3

25th Annual Conference on Composites, Advanced Ceramics, Materials, and Structures: A: Ceramic Engineering and Science Proceedings, Volume 22, Issue 3

How to Cite

Hurwitz, F. I., Calomino, A. M., Mccue, T. R. and Abdul-Aziz, A. (2001) C-Coupon Studies of Cmcs: Fracture Behavior and Microstructural Characterization, in 25th Annual Conference on Composites, Advanced Ceramics, Materials, and Structures: A: Ceramic Engineering and Science Proceedings, Volume 22, Issue 3 (eds M. Singh and T. Jessen), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470294680.ch67

Author Information

  1. 1

    NASA Glenn Research Center Cleveland, OH 44135

  2. 2

    Dynacs Engineering Co., Inc. Brookpark, OH 44142

  3. 3

    Cleveland State University Cleveland, OH 44115

Publication History

  1. Published Online: 26 MAR 2008
  2. Published Print: 1 JAN 2001

ISBN Information

Print ISBN: 9780470375730

Online ISBN: 9780470294680

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Keywords:

  • composite;
  • electron;
  • architectures;
  • microstructure;
  • temperature

Summary

A curved beam “C-coupon” was used to assess fracture behavior in a SylramicTM\melt infiltration (MI) SiC matrix composite. Failure stresses and fracture mechanisms, as determined by optical and scanning electron microstructual analysis, are compared with finite element stress calculations to analyze failure modes. Material microstructure was found to have a strong influence on mechanical behavior. Fracture occurs in interlaminar tension (ILT), provided that the ratio of ILT to tensile strength for the material is less than the ratio of radial to hoop stresses for the C-coupon geometry. Utilization of 3D architectures to improve interlaminar strength requires significant development efforts to incorporate through thickness fibers in regions with high curvatures while maintaining uniform thickness, radius and microstructure.