Chapter 15. Influence of Cooling Hole Geometry and Material Conductivity on the Thermal Response of Cooled Silicon Nitride Plate

  1. Hua-Tay Lin and
  2. Mrityunjay Singh
  1. Ali Abdul-Aziz and
  2. Ramakrishna T. Bhatt

Published Online: 26 MAR 2008

DOI: 10.1002/9780470294741.ch15

26th Annual Conference on Composites, Advanced Ceramics, Materials, and Structures: A: Ceramic Engineering and Science Proceedings, Volume 23, Issue 3

26th Annual Conference on Composites, Advanced Ceramics, Materials, and Structures: A: Ceramic Engineering and Science Proceedings, Volume 23, Issue 3

How to Cite

Abdul-Aziz, A. and Bhatt, R. T. (2002) Influence of Cooling Hole Geometry and Material Conductivity on the Thermal Response of Cooled Silicon Nitride Plate, in 26th Annual Conference on Composites, Advanced Ceramics, Materials, and Structures: A: Ceramic Engineering and Science Proceedings, Volume 23, Issue 3 (eds H.-T. Lin and M. Singh), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470294741.ch15

Author Information

  1. Cleveland State University, Department of Civil and Environmental Engineering, NASA Glenn Resident Research Associate, 21000 Brook Park Rd. MS 6–1, Cleveland, Ohio 44135, Telephone 216–433–6729, Fax 216–977–7150

Publication History

  1. Published Online: 26 MAR 2008
  2. Published Print: 1 JAN 2002

ISBN Information

Print ISBN: 9780470375785

Online ISBN: 9780470294741

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Keywords:

  • parametric;
  • thermal conductivity;
  • thermal stress;
  • capability;
  • silicon nitride

Summary

To complement the effectiveness of ceramic materials and their applicability for turbine engine applications, a parametric study using finite element method is carried out. This study tackles thorough analyses of a thermal barrier coated plate specimen with cooling holes made out of Silicon Nitride (Si3N4) where its thermal conductivity is varied in an attempt to minimize the thermal stresses and to optimize an ultimate state of stress. The thermal stress profile was generated for circular and square cooling channels. Lower stresses for a higher magnitude of thermal conductivity are reported. Contour plots for the stresses and the temperature are presented and discussed.