Chapter 18. Heat Transfer Coefficient Estimation from Thermal Shock Data

  1. Hua-Tay Lin and
  2. Mrityunjay Singh
  1. E. D. Case

Published Online: 26 MAR 2008

DOI: 10.1002/9780470294741.ch18

26th Annual Conference on Composites, Advanced Ceramics, Materials, and Structures: A: Ceramic Engineering and Science Proceedings, Volume 23, Issue 3

26th Annual Conference on Composites, Advanced Ceramics, Materials, and Structures: A: Ceramic Engineering and Science Proceedings, Volume 23, Issue 3

How to Cite

Case, E. D. (2008) Heat Transfer Coefficient Estimation from Thermal Shock Data, in 26th Annual Conference on Composites, Advanced Ceramics, Materials, and Structures: A: Ceramic Engineering and Science Proceedings, Volume 23, Issue 3 (eds H.-T. Lin and M. Singh), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470294741.ch18

Author Information

  1. Chemical Engineering and Materials Science Department Michigan State University East Lansing, MI 48824

Publication History

  1. Published Online: 26 MAR 2008
  2. Published Print: 1 JAN 2002

ISBN Information

Print ISBN: 9780470375785

Online ISBN: 9780470294741

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Keywords:

  • bioceramics;
  • parameter;
  • thermal shock;
  • coefficient;
  • microcracks

Summary

Thermal shock and thermal fatigue can induce significant damage in structural, electronic, optical ceramics as well as in bioceramics. Such damage can limit the use of ceramics in a variety of applications that involve rapid changes in the ambient temperature. The surface heat transfer coefficient, h, is a key parameter in estimating thermal stresses that a component experiences during thermal shock. A method is discussed for using data on the critical quench temperature difference to estimate h.