Chapter 18. Heat Transfer Coefficient Estimation from Thermal Shock Data
- Hua-Tay Lin,
- Mrityunjay Singh
Published Online: 26 MAR 2008
DOI: 10.1002/9780470294741.ch18
Copyright © 2002 The American Ceramic Society
Book Title
26th Annual Conference on Composites, Advanced Ceramics, Materials, and Structures: A: Ceramic Engineering and Science Proceedings, Volume 23, Issue 3
Additional Information
How to Cite
Case, E. D. (2008) Heat Transfer Coefficient Estimation from Thermal Shock Data, in 26th Annual Conference on Composites, Advanced Ceramics, Materials, and Structures: A: Ceramic Engineering and Science Proceedings, Volume 23, Issue 3 (eds H.-T. Lin and M. Singh), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470294741.ch18
Publication History
- Published Online: 26 MAR 2008
- Published Print: 1 JAN 2002
Book Series:
ISBN Information
Print ISBN: 9780470375785
Online ISBN: 9780470294741
- Summary
- Chapter
- References
Keywords:
- bioceramics;
- parameter;
- thermal shock;
- coefficient;
- microcracks
Summary
Thermal shock and thermal fatigue can induce significant damage in structural, electronic, optical ceramics as well as in bioceramics. Such damage can limit the use of ceramics in a variety of applications that involve rapid changes in the ambient temperature. The surface heat transfer coefficient, h, is a key parameter in estimating thermal stresses that a component experiences during thermal shock. A method is discussed for using data on the critical quench temperature difference to estimate h.