Chapter 44. C-Coupon Studies of SiC/SiC Composites Part I: Acoustic Emission Monitoring

Summary

Modal acoustic emission (AE) was used to monitor the acoustic activity during room temperature and elevated temperature c-coupon tests for a variety of SiC/SiC systems including composites containing Sylramic®, ZMI™, or Hi-Nicalon™ fibers with meit-infiltrated or polymer-infiltrated SiC matrices. Modal AE proved excellent at monitoring matrix cracking in the curved portion of the C-coupon specimen with increasing load. This included the load at which the first AE event occurred and the location of AE events during the test that were, presumably, caused by the formation and growth of interlaminar cracks and, at higher loads, transverse cracks. Graphical techniques were employed to estimate the load for 1^st AE. It was determined that for this test with these material systems, the first AE could be estimated within the load range bounded by the load at which initial deviation from linearity of the load-displacement curve occurs and the load where the 98% offset of the linear regression fit intercepted the load-displacement curve. The calculation of interlaminar tensile stress from the load for 1^st AE was determined for all the systems. Ultimate ILT strength usually corresponded to ILT stress determined from the ultimate load to failure of the C-coupon test, which was considerably higher than the first cracking stress.