Chapter 71. Effect of Thermal Cycling to the Strength and Fracture of SiC-Based Candle Filters
- Hua-Tay Lin,
- Mrityunjay Singh
Published Online: 26 MAR 2008
DOI: 10.1002/9780470294741.ch71
Copyright © 2002 The American Ceramic Society
Book Title
26th Annual Conference on Composites, Advanced Ceramics, Materials, and Structures: A: Ceramic Engineering and Science Proceedings, Volume 23, Issue 3
Additional Information
How to Cite
Pastila, P., Nikkilä, A.-P., Mäntylä, T. and Lara-Curzio, E. (2008) Effect of Thermal Cycling to the Strength and Fracture of SiC-Based Candle Filters, in 26th Annual Conference on Composites, Advanced Ceramics, Materials, and Structures: A: Ceramic Engineering and Science Proceedings, Volume 23, Issue 3 (eds H.-T. Lin and M. Singh), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470294741.ch71
Publication History
- Published Online: 26 MAR 2008
- Published Print: 1 JAN 2002
Book Series:
ISBN Information
Print ISBN: 9780470375785
Online ISBN: 9780470294741
- Summary
- Chapter
- References
Keywords:
- durability;
- mechanisms;
- tensile axial strength;
- silicon carbide;
- transformation
Summary
In order to model the long-term durability and reliability of SiC-based, clay-bonded ceramic candle filters at complex service environments, it is first necessary to understand the mechanisms responsible for their failure in a manner that is scientifically and technologically tractable, i.e.-through experiments at the laboratory scale. In this work, the strength and fracture behavior of commercial SiC- based candle filter material were studied.
The effect of thermal cycling between 150°C and 400°C on the strength and fracture toughness of the material was investigated. The behavior of as received material was used as reference for room temperature hoop and tensile strengths and for high temperature tensile stress-strain response. The microstructure and fracture surfaces of the test specimens were characterized using conventional techniques. It was found that thermal cycling increased both the tensile hoop and tensile axial strength of the material. It was also found that thermal cycling modified the path of crack propagation between the binder phase and the SiC-grains.