Chapter 72. Creep Rupture Behavior of Oxide/Oxide Nextel ™720/AS and MI SiC/SiC Composites with Effusion Holes
- Hua-Tay Lin and
- Mrityunjay Singh
Published Online: 26 MAR 2008
Copyright © 2002 The American Ceramic Society
26th Annual Conference on Composites, Advanced Ceramics, Materials, and Structures: A: Ceramic Engineering and Science Proceedings, Volume 23, Issue 3
How to Cite
John, R., Buchanan, D. J., Kramb, V. A. and Zawada, L. P. (2002) Creep Rupture Behavior of Oxide/Oxide Nextel ™720/AS and MI SiC/SiC Composites with Effusion Holes, in 26th Annual Conference on Composites, Advanced Ceramics, Materials, and Structures: A: Ceramic Engineering and Science Proceedings, Volume 23, Issue 3 (eds H.-T. Lin and M. Singh), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470294741.ch72
- Published Online: 26 MAR 2008
- Published Print: 1 JAN 2002
Print ISBN: 9780470375785
Online ISBN: 9780470294741
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