Chapter 72. Creep Rupture Behavior of Oxide/Oxide Nextel ™720/AS and MI SiC/SiC Composites with Effusion Holes

  1. Hua-Tay Lin and
  2. Mrityunjay Singh
  1. Reji John1,
  2. Dennis J. Buchanan2,
  3. Victoria A. Kramb2 and
  4. Larry P. Zawada1

Published Online: 26 MAR 2008

DOI: 10.1002/9780470294741.ch72

26th Annual Conference on Composites, Advanced Ceramics, Materials, and Structures: A: Ceramic Engineering and Science Proceedings, Volume 23, Issue 3

26th Annual Conference on Composites, Advanced Ceramics, Materials, and Structures: A: Ceramic Engineering and Science Proceedings, Volume 23, Issue 3

How to Cite

John, R., Buchanan, D. J., Kramb, V. A. and Zawada, L. P. (2002) Creep Rupture Behavior of Oxide/Oxide Nextel ™720/AS and MI SiC/SiC Composites with Effusion Holes, in 26th Annual Conference on Composites, Advanced Ceramics, Materials, and Structures: A: Ceramic Engineering and Science Proceedings, Volume 23, Issue 3 (eds H.-T. Lin and M. Singh), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470294741.ch72

Author Information

  1. 1

    Air Force Research Laboratory, Materials and Manufacturing Directorate (AFRL/MLLMN), Wright-Patterson AFB, OH 45433–7817, USA

  2. 2

    University of Dayton Research Institute, Dayton, OH 45419, USA

Publication History

  1. Published Online: 26 MAR 2008
  2. Published Print: 1 JAN 2002

ISBN Information

Print ISBN: 9780470375785

Online ISBN: 9780470294741

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