Chapter 94. Active Brazing Alloy Produced by Electroless Plating Technique

  1. Hua-Tay Lin and
  2. Mrityunjay Singh
  1. M. Brochu1,
  2. R.A.L. Drew1 and
  3. M.D. Pugh2

Published Online: 26 MAR 2008

DOI: 10.1002/9780470294741.ch94

26th Annual Conference on Composites, Advanced Ceramics, Materials, and Structures: A: Ceramic Engineering and Science Proceedings, Volume 23, Issue 3

26th Annual Conference on Composites, Advanced Ceramics, Materials, and Structures: A: Ceramic Engineering and Science Proceedings, Volume 23, Issue 3

How to Cite

Brochu, M., Drew, R.A.L. and Pugh, M.D. (2002) Active Brazing Alloy Produced by Electroless Plating Technique, in 26th Annual Conference on Composites, Advanced Ceramics, Materials, and Structures: A: Ceramic Engineering and Science Proceedings, Volume 23, Issue 3 (eds H.-T. Lin and M. Singh), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470294741.ch94

Author Information

  1. 1

    McGill University Metals and Materials Eng. Dept. 3610 University Street Montreal, Quebec, Canada H3A2B2

  2. 2

    Concordia University Mechancial Eng. Dept. 1455 de Maisonneuve Blvd. West Montreal, Quebec, Canada H3G 1M8

Publication History

  1. Published Online: 26 MAR 2008
  2. Published Print: 1 JAN 2002

ISBN Information

Print ISBN: 9780470375785

Online ISBN: 9780470294741

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Keywords:

  • non-wetting;
  • composition;
  • absorption;
  • wetting experiments;
  • spectroscopy

Summary

It is known that ceramics in general, are either non-wetting or show poor wetting by pure metals. However, good wetting behaviour is one of the most important requirements for successful brazing. This paper will introduce an electroless coating technique used to produce an active brazing alloy (ABA). The technique can also be extended to produce other binary and ternary ABAs. Cu-25Ti was produced by precipitation of Cu on Ti powder after 19 cycles. The initial plating shows that for 60 minutes of deposition, around 9wt% of copper can be deposited on 15 grams of titanium powder. The wetting behaviour of this ABA on α-Si3N4 substrate shows a rapid decrease of the contact angle and that equilibrium is reached after 15 minutes with an angle 20°. SEM and XRD characterisation are presented as well as the microstructure of an ABA-Si3N4 interface.