Chapter 28. Effects of Porosity on Thermal Shock Resistance of Silicon Nitride Ceramics
- Hau-Tay Lin,
- Mrityunjay Singh
Published Online: 26 MAR 2008
DOI: 10.1002/9780470294758.ch28
Copyright © 2002 The American Ceramic Society
Book Title

26th Annual Conference on Composites, Advanced Ceramics, Materials, and Structures: B: Ceramic Engineering and Science Proceedings, Volume 23, Issue 4
Additional Information
How to Cite
She, J. H., Beppu, Y., Yang, J. F., Jayaseelan, D. D. and Ohji, T. (2008) Effects of Porosity on Thermal Shock Resistance of Silicon Nitride Ceramics, in 26th Annual Conference on Composites, Advanced Ceramics, Materials, and Structures: B: Ceramic Engineering and Science Proceedings, Volume 23, Issue 4 (eds H.-T. Lin and M. Singh), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470294758.ch28
Publication History
- Published Online: 26 MAR 2008
- Published Print: 1 JAN 2002
Book Series:
ISBN Information
Print ISBN: 9780470375792
Online ISBN: 9780470294758
- Summary
- Chapter
- References
Keywords:
- binder induced porosity;
- tape casting;
- propagation;
- slipcast alumina;
- sintering
Summary
A water-quenching technique was employed to investigate the effect of porosity on the thermal shock behavior of Si3N4 ceramics. It is shown that the critical temperature difference for crack initiation decreases with increasing porosity. However, the presence of more pores increases the resistance to crack propagation. In low-porosity Si3N4, crack was observed to propagate catastrophically. In contrast, highly porous Si3N4 ceramics exhibited a quasi-static crack propagation and thus a gradual reduction in strength with quenching severity.
