Chapter 10. A New High Resolution Process for Passives in Hybrid Packaging

  1. Waltraud M. Kriven and
  2. Hua-Tay Lin
  1. Charles D. E. Lakeman,
  2. Patrick F. Fleig and
  3. Hope R. Perry

Published Online: 26 MAR 2008

DOI: 10.1002/9780470294826.ch10

27th Annual Cocoa Beach Conference on Advanced Ceramics and Composites: B: Ceramic Engineering and Science Proceedings, Volume 24, Issue 4

27th Annual Cocoa Beach Conference on Advanced Ceramics and Composites: B: Ceramic Engineering and Science Proceedings, Volume 24, Issue 4

How to Cite

Lakeman, C. D. E., Fleig, P. F. and Perry, H. R. (2003) A New High Resolution Process for Passives in Hybrid Packaging, in 27th Annual Cocoa Beach Conference on Advanced Ceramics and Composites: B: Ceramic Engineering and Science Proceedings, Volume 24, Issue 4 (eds W. M. Kriven and H.-T. Lin), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470294826.ch10

Author Information

  1. TPL Inc. 3921 Academy Parkway North, NE Albuquerque, NM 87109

Publication History

  1. Published Online: 26 MAR 2008
  2. Published Print: 1 JAN 2003

ISBN Information

Print ISBN: 9780470375846

Online ISBN: 9780470294826

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Keywords:

  • electronic circuitsa;
  • optimze utilization;
  • fabricating;
  • semiconductor;
  • resistor materials

Summary

As the number of passive components in electronic circuits increases, new methods for fabricating passives are under development to optimize utilization of board space. In this paper, we will describe the performance capabilities of TPL's microcontact printing (μCP) process to fabricate near-net-shape structures with feature sizes that range from 100 microns to the sub-micron scale. Like thick film processes, this novel process is compatible with a broad materials base, making a large range of materials properties available. Unlike thick film, however, this novel process employs powder-free inks that can be patterned with high resolution. It is anticipated that this process will enable integration of passive components that show thin film performance at thick film cost. Emphasis in this paper will be placed on processing conditions and materials properties to demonstrate the feasibility of this process for passive device fabrication.