Chapter 46. Thermal Barrier Coating and Cooling Hole Size Effects on the Thermo-Mechanical Response of Cooled Silicon Nitride Plate

  1. Waltraud M. Kriven and
  2. Hua-Tay Lin
  1. Ali Abdul-Aziz,
  2. Ramakrishna T. Bhatt and
  3. Georg E. Baaklini

Published Online: 26 MAR 2008

DOI: 10.1002/9780470294826.ch46

27th Annual Cocoa Beach Conference on Advanced Ceramics and Composites: B: Ceramic Engineering and Science Proceedings, Volume 24, Issue 4

27th Annual Cocoa Beach Conference on Advanced Ceramics and Composites: B: Ceramic Engineering and Science Proceedings, Volume 24, Issue 4

How to Cite

Abdul-Aziz, A., Bhatt, R. T. and Baaklini, G. E. (2008) Thermal Barrier Coating and Cooling Hole Size Effects on the Thermo-Mechanical Response of Cooled Silicon Nitride Plate, in 27th Annual Cocoa Beach Conference on Advanced Ceramics and Composites: B: Ceramic Engineering and Science Proceedings, Volume 24, Issue 4 (eds W. M. Kriven and H.-T. Lin), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470294826.ch46

Author Information

  1. Cleveland, Ohio 44135, Glenn Research Center

Publication History

  1. Published Online: 26 MAR 2008
  2. Published Print: 1 JAN 2003

ISBN Information

Print ISBN: 9780470375846

Online ISBN: 9780470294826

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Keywords:

  • thermal analysis;
  • cooling hole geometries;
  • silicon nitride;
  • thermal boundary;
  • hot gases

Summary

Steady state thermal analysis with coupled stress analyses were conducted to study the effect of cooling hole geometries on a silicon nitride (Si3N4) cooling plate. The plate was subjected to a simulated burner rig thermal boundary conditions. The application of a thermal barrier coating (TBC) to the side that is exposed to the hot gases are also included. The presence of the TBC was able to reduce the temperature in the substrate by at least 7% resulting in a decrease in the maximum principal stress by 33%. The larger the cooling holes and the smaller spacing in between further reduced the temperature and consequently the stresses.