Chapter 55. Piezoelectric Actuation of Crack Growth Along Polymer/Metal Interfaces in Adhesive Bonds

  1. Waltraud M. Kriven and
  2. Hua-Tay Lin
  1. Tianbao Du1 and
  2. Jian-Ku Shang2

Published Online: 26 MAR 2008

DOI: 10.1002/9780470294826.ch55

27th Annual Cocoa Beach Conference on Advanced Ceramics and Composites: B: Ceramic Engineering and Science Proceedings, Volume 24, Issue 4

27th Annual Cocoa Beach Conference on Advanced Ceramics and Composites: B: Ceramic Engineering and Science Proceedings, Volume 24, Issue 4

How to Cite

Du, T. and Shang, J.-K. (2003) Piezoelectric Actuation of Crack Growth Along Polymer/Metal Interfaces in Adhesive Bonds, in 27th Annual Cocoa Beach Conference on Advanced Ceramics and Composites: B: Ceramic Engineering and Science Proceedings, Volume 24, Issue 4 (eds W. M. Kriven and H.-T. Lin), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470294826.ch55

Author Information

  1. 1

    University of Central Florida, 12146 Mendel Dr., Orlando, FL 32826

  2. 2

    University of Illinois at Urbana-Champaign, 1304 W. Green St., Urbana, IL 61801

Publication History

  1. Published Online: 26 MAR 2008
  2. Published Print: 1 JAN 2003

ISBN Information

Print ISBN: 9780470375846

Online ISBN: 9780470294826

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