Chapter 45. Environmental Effects on Slow Crack Growth in Silicon Nitride

  1. John B. Wachtman Jr
  1. C. H. Henager Jr and
  2. R. H. Jones

Published Online: 26 MAR 2008

DOI: 10.1002/9780470310502.ch45

12th Annual Conference on Composites and Advanced Ceramic Materials, Part 2 of 2: Ceramic Engineering and Science Proceedings, Volume 9, Issue 9/10

12th Annual Conference on Composites and Advanced Ceramic Materials, Part 2 of 2: Ceramic Engineering and Science Proceedings, Volume 9, Issue 9/10

How to Cite

Henager, C. H. and Jones, R. H. (1988) Environmental Effects on Slow Crack Growth in Silicon Nitride, in 12th Annual Conference on Composites and Advanced Ceramic Materials, Part 2 of 2: Ceramic Engineering and Science Proceedings, Volume 9, Issue 9/10 (ed J. B. Wachtman), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470310502.ch45

Author Information

  1. Pacific Northwest Laboratory, Richland, WA 99352

Publication History

  1. Published Online: 26 MAR 2008
  2. Published Print: 1 JAN 1988

ISBN Information

Print ISBN: 9780470374818

Online ISBN: 9780470310502

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Keywords:

  • intensity;
  • sodium sulfate;
  • slow crack growth (SCG);
  • NCX- 134;
  • knife-edge

Summary

Slow crack growth measurements are being conducted to determine crack velocity vs stress intensity as a function of chemical environment in advanced ceramic materials. Controlled, artificial flaws are placed in the flat tensile faces of hot pressed S13JV4 tensile specimens (23 by 23 by 21.6-mm gage) and oriented to open in mode I on tensile loading. Tests have been performed in air with and without a coating of sodium sulfate at 1573 K. The results indicate that slow crack growth in the presence of sodium sulfate is about twice as fast as in air.