Chapter 8. Ceramic Coatings Via PVD
- John B. Wachtman Jr
Published Online: 26 MAR 2008
Copyright © 1988 The American Ceramics Society, Inc.
12th Annual Conference on Composites and Advanced Ceramic Materials, Part 2 of 2: Ceramic Engineering and Science Proceedings, Volume 9, Issue 9/10
How to Cite
Dearnley, P. A. and Bell, T. (1988) Ceramic Coatings Via PVD, in 12th Annual Conference on Composites and Advanced Ceramic Materials, Part 2 of 2: Ceramic Engineering and Science Proceedings, Volume 9, Issue 9/10 (ed J. B. Wachtman), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470310502.ch8
- Published Online: 26 MAR 2008
- Published Print: 1 JAN 1988
Print ISBN: 9780470374818
Online ISBN: 9780470310502
- physical vapor deposition;
Physical vapor deposition (PVD) of ceramics has only recently reached commercial maturity. There are two main process categories: sputter source PVD and evaporative source PVD. Both methods have received their greatest development for the deposition of TiN. Both processes offer, in principle, the possibility to deposit a variety of alternative ceramic coatings. However, only the sputter source processes currently offer this commercial capability. Most PVD systems produce strongly oriented coatings, containing varying degrees of residual elastic stress, depending upon the coating/substrate composite body concerned.