Chapter 1. Multichip Module Technology
- John B. Wachtman Jr.
Published Online: 26 MAR 2008
Copyright © 1988 The American Ceramic Society, Inc.
Cofire Technology: Ceramic Engineering and Science Proceedings, Volume 9, Issue 11/12
How to Cite
Barbour, D. R. (1988) Multichip Module Technology, in Cofire Technology: Ceramic Engineering and Science Proceedings, Volume 9, Issue 11/12 (ed J. B. Wachtman), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470310519.ch1
- Published Online: 26 MAR 2008
- Published Print: 1 JAN 1988
Print ISBN: 9780470374825
Online ISBN: 9780470310519
As circuit density increases are achieved in semiconductors, there is a need to preserve and complement these improvements at the package level to provide the system designer with a technology that optimizes performance, reliability, and cost. At IBM, we have taken the path of multichip modules to achieve these objectives. This paper provides an overview of the TCM design and discussion of the module manufacturing processes. Key manufacturing challenges are highlighted.