Chapter 1. Multichip Module Technology

  1. John B. Wachtman Jr.
  1. D. R. Barbour

Published Online: 26 MAR 2008

DOI: 10.1002/9780470310519.ch1

Cofire Technology: Ceramic Engineering and Science Proceedings, Volume 9, Issue 11/12

Cofire Technology: Ceramic Engineering and Science Proceedings, Volume 9, Issue 11/12

How to Cite

Barbour, D. R. (1988) Multichip Module Technology, in Cofire Technology: Ceramic Engineering and Science Proceedings, Volume 9, Issue 11/12 (ed J. B. Wachtman), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470310519.ch1

Author Information

  1. IBM Corporation, Hopewell Junction, New York 12533

Publication History

  1. Published Online: 26 MAR 2008
  2. Published Print: 1 JAN 1988

ISBN Information

Print ISBN: 9780470374825

Online ISBN: 9780470310519

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Keywords:

  • density;
  • semiconductors;
  • reliability;
  • semiconductors;
  • substrate

Summary

As circuit density increases are achieved in semiconductors, there is a need to preserve and complement these improvements at the package level to provide the system designer with a technology that optimizes performance, reliability, and cost. At IBM, we have taken the path of multichip modules to achieve these objectives. This paper provides an overview of the TCM design and discussion of the module manufacturing processes. Key manufacturing challenges are highlighted.