Chapter 1. Low Dielectric Constant, Alumina-Compatible, Co-Fired Multilayer Substrate
- John B. Wachtman Jr.
Published Online: 26 MAR 2008
Copyright © 1988 The American Ceramic Society, Inc.
Cofire Technology: Ceramic Engineering and Science Proceedings, Volume 9, Issue 11/12
How to Cite
Mattox, D. M., Gurkovich, S. R., Olenick, J. A. and Mason, K. M. (1988) Low Dielectric Constant, Alumina-Compatible, Co-Fired Multilayer Substrate, in Cofire Technology: Ceramic Engineering and Science Proceedings, Volume 9, Issue 11/12 (ed J. B. Wachtman), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470310519.ch2
- Published Online: 26 MAR 2008
- Published Print: 1 JAN 1988
Print ISBN: 9780470374825
Online ISBN: 9780470310519
- thermal expansion;
A low dielectric constant, Al2O3-compatible, co-fired, multilayer ceramic (CMC) substrate system has been developed. The system differs from other recently announced CMC systems in that it has thermal expansion compatibility with Al2O3, a dielectric constant of 4 and 30 vol% glass. The low dielectric CMC is prepared according to a computer designed formulation of quartz filler and low viscosity, CaOB2O3-Al2O3-based glass binder. The material is fired at 900C, allowing high conductivity gold metallization. Final porosity <3% is made possible by careful sizing of the starting powders.