Chapter 1. Low Dielectric Constant, Alumina-Compatible, Co-Fired Multilayer Substrate

  1. John B. Wachtman Jr.
  1. Douglas M. Mattox,
  2. Stephen R. Gurkovich,
  3. John A. Olenick and
  4. Keith M. Mason

Published Online: 26 MAR 2008

DOI: 10.1002/9780470310519.ch2

Cofire Technology: Ceramic Engineering and Science Proceedings, Volume 9, Issue 11/12

Cofire Technology: Ceramic Engineering and Science Proceedings, Volume 9, Issue 11/12

How to Cite

Mattox, D. M., Gurkovich, S. R., Olenick, J. A. and Mason, K. M. (1988) Low Dielectric Constant, Alumina-Compatible, Co-Fired Multilayer Substrate, in Cofire Technology: Ceramic Engineering and Science Proceedings, Volume 9, Issue 11/12 (ed J. B. Wachtman), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470310519.ch2

Author Information

  1. Westinghouse Research Development Center, Pittsburgh, PA 15221

Publication History

  1. Published Online: 26 MAR 2008
  2. Published Print: 1 JAN 1988

ISBN Information

Print ISBN: 9780470374825

Online ISBN: 9780470310519

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Keywords:

  • thermal expansion;
  • conductivity;
  • metallization;
  • consideration;
  • dissipation

Summary

A low dielectric constant, Al2O3-compatible, co-fired, multilayer ceramic (CMC) substrate system has been developed. The system differs from other recently announced CMC systems in that it has thermal expansion compatibility with Al2O3, a dielectric constant of 4 and 30 vol% glass. The low dielectric CMC is prepared according to a computer designed formulation of quartz filler and low viscosity, CaOB2O3-Al2O3-based glass binder. The material is fired at 900C, allowing high conductivity gold metallization. Final porosity <3% is made possible by careful sizing of the starting powders.