Chapter 1. Filling the Gap between Thick and Thin Film
- John B. Wachtman Jr.
Published Online: 26 MAR 2008
Copyright © 1988 The American Ceramic Society, Inc.
Cofire Technology: Ceramic Engineering and Science Proceedings, Volume 9, Issue 11/12
How to Cite
Rinne, R. A. and Fritz, H. L. (1988) Filling the Gap between Thick and Thin Film, in Cofire Technology: Ceramic Engineering and Science Proceedings, Volume 9, Issue 11/12 (ed J. B. Wachtman), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470310519.ch3
- Published Online: 26 MAR 2008
- Published Print: 1 JAN 1988
Print ISBN: 9780470374825
Online ISBN: 9780470310519
Ceramic card circuits are usually made by sequentially screen printing and firing patterns of thick film conductor, dielectric, and via fill materials on ceramic substrates. Conductor resolution and shape and via size are limited. Thin film technologies similar to photolithographic techniques used to fabricate IC chips are being used for ultrahigh resolution circuits but are expensive for intermediate applications. New photosensitive materials and processes have been developed which bridge the performance gap between conventional thick and thin film technologies.