Chapter 1. Electrical, Mechanical, and Thermal Characterization of a Cofired, Multilayer Substrate Processed from Sol-Gel Silica
- John B. Wachtman Jr.
Published Online: 26 MAR 2008
Copyright © 1988 The American Ceramic Society, Inc.
Cofire Technology: Ceramic Engineering and Science Proceedings, Volume 9, Issue 11/12
How to Cite
Sanchez, L. E. (1988) Electrical, Mechanical, and Thermal Characterization of a Cofired, Multilayer Substrate Processed from Sol-Gel Silica, in Cofire Technology: Ceramic Engineering and Science Proceedings, Volume 9, Issue 11/12 (ed J. B. Wachtman), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470310519.ch4
- Published Online: 26 MAR 2008
- Published Print: 1 JAN 1988
Print ISBN: 9780470374825
Online ISBN: 9780470310519
- thermal dissipation;
- refractory metals;
The electrical, mechanical, and thermal characteristics of multilayer boards constructed by cofired techniques from monosized, spherical, boron-doped, amorphous silica are described. This work is in response to a rapidly developing need for the packaging of GaAs and other VHSIC devices.