Chapter 1. Electrical, Mechanical, and Thermal Characterization of a Cofired, Multilayer Substrate Processed from Sol-Gel Silica

  1. John B. Wachtman Jr.
  1. L. E. Sanchez

Published Online: 26 MAR 2008

DOI: 10.1002/9780470310519.ch4

Cofire Technology: Ceramic Engineering and Science Proceedings, Volume 9, Issue 11/12

Cofire Technology: Ceramic Engineering and Science Proceedings, Volume 9, Issue 11/12

How to Cite

Sanchez, L. E. (1988) Electrical, Mechanical, and Thermal Characterization of a Cofired, Multilayer Substrate Processed from Sol-Gel Silica, in Cofire Technology: Ceramic Engineering and Science Proceedings, Volume 9, Issue 11/12 (ed J. B. Wachtman), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470310519.ch4

Author Information

  1. McDonnell Douglas Astronautics Co., Huntington Beach, CA

Publication History

  1. Published Online: 26 MAR 2008
  2. Published Print: 1 JAN 1988

ISBN Information

Print ISBN: 9780470374825

Online ISBN: 9780470310519

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Keywords:

  • characteristics;
  • interconductor;
  • thermal dissipation;
  • refractory metals;
  • transformation

Summary

The electrical, mechanical, and thermal characteristics of multilayer boards constructed by cofired techniques from monosized, spherical, boron-doped, amorphous silica are described. This work is in response to a rapidly developing need for the packaging of GaAs and other VHSIC devices.