Chapter 1. Materials Compatibility and Co-Sintering Aspects in Low Temperature Co-Fired Ceramic Packages
- John B. Wachtman Jr.
Published Online: 26 MAR 2008
Copyright © 1988 The American Ceramic Society, Inc.
Cofire Technology: Ceramic Engineering and Science Proceedings, Volume 9, Issue 11/12
How to Cite
Sawhill, H. T. (1988) Materials Compatibility and Co-Sintering Aspects in Low Temperature Co-Fired Ceramic Packages, in Cofire Technology: Ceramic Engineering and Science Proceedings, Volume 9, Issue 11/12 (ed J. B. Wachtman), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470310519.ch5
- Published Online: 26 MAR 2008
- Published Print: 1 JAN 1988
Print ISBN: 9780470374825
Online ISBN: 9780470310519
- diagonal dimension;
Low temperature co-fireable ceramic dielectric tape systems offer new opportunities for advanced electronic packaging. Adoption of this technology will allow packages to be functionally denser and electrically faster. Post-fired processing requires the shrinkage during co-firing of these packages to be controlled within tight tolerances. This paper describes the co-sintering behavior of low temperature system components (tape dielectric, thick film conductor, and buried passives) and its relation to shrinkage control of co-fired multilayers.