Chapter 1. Materials Compatibility and Co-Sintering Aspects in Low Temperature Co-Fired Ceramic Packages

  1. John B. Wachtman Jr.
  1. Howard T. Sawhill

Published Online: 26 MAR 2008

DOI: 10.1002/9780470310519.ch5

Cofire Technology: Ceramic Engineering and Science Proceedings, Volume 9, Issue 11/12

Cofire Technology: Ceramic Engineering and Science Proceedings, Volume 9, Issue 11/12

How to Cite

Sawhill, H. T. (1988) Materials Compatibility and Co-Sintering Aspects in Low Temperature Co-Fired Ceramic Packages, in Cofire Technology: Ceramic Engineering and Science Proceedings, Volume 9, Issue 11/12 (ed J. B. Wachtman), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470310519.ch5

Author Information

  1. Electronics Dept., R&D Div. E. I. du Pont de Nemours & Co., Inc. Experimental Station Wilmington, DE 19898

Publication History

  1. Published Online: 26 MAR 2008
  2. Published Print: 1 JAN 1988

ISBN Information

Print ISBN: 9780470374825

Online ISBN: 9780470310519

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Keywords:

  • dielectric;
  • co-sintering;
  • reproducibility;
  • diagonal dimension;
  • tolerances

Summary

Low temperature co-fireable ceramic dielectric tape systems offer new opportunities for advanced electronic packaging. Adoption of this technology will allow packages to be functionally denser and electrically faster. Post-fired processing requires the shrinkage during co-firing of these packages to be controlled within tight tolerances. This paper describes the co-sintering behavior of low temperature system components (tape dielectric, thick film conductor, and buried passives) and its relation to shrinkage control of co-fired multilayers.