Chapter 1. Advantages of Co-Fired Multilayer over Thick Film Technology
- John B. Wachtman Jr.
Published Online: 26 MAR 2008
Copyright © 1988 The American Ceramic Society, Inc.
Cofire Technology: Ceramic Engineering and Science Proceedings, Volume 9, Issue 11/12
How to Cite
Verma, K. K. (2008) Advantages of Co-Fired Multilayer over Thick Film Technology, in Cofire Technology: Ceramic Engineering and Science Proceedings, Volume 9, Issue 11/12 (ed J. B. Wachtman), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470310519.ch6
- Published Online: 26 MAR 2008
- Published Print: 1 JAN 1988
Print ISBN: 9780470374825
Online ISBN: 9780470310519
- hermetic module;
Co-fired multilayer is fabricated by printing each conductor layer over a 5-10-mil-thick green ceramic (dielectric)tape. All the tape layers are then laminated and co-fired, one time. The entire co-fired multilayer circuit is contained within the ceramic. A brazed seal ring on multilayer co-fired ceramic, normally called a ceramic module, is an equivalent of a metal header with a thick film substrate mounted inside. Instead of metal pins and a glass-to-metal seal through metal header walls, the interconnects are brought outside through conductor filled vias, and the wire bonding is done on the metallized via termination pads. Elimination of the metal header, glass-to-metal seals, substrate fabrication, epoxy attach (and therefore, epoxy as a source of contamination), and thermal barrier provides a more reliable package and advantages in cost, weight, and space savings. With the elimination of several materials and processes, the corresponding procurement documents for materials, processes, and test specs are also eliminated, providing further cost advantage at the total systems level.