Chapter 58. Thermal Diffusivity/Conductivity of Alumina-Silicon Carbide Composites
- John B. Wachtman Jr.
Published Online: 26 MAR 2008
Copyright © 1989 The American Ceramic Society, Inc.
A Collection of Papers Presented at the 13th Annual Conference on Composites and Advanced Ceramic Materials, Part 1 of 2: Ceramic Engineering and Science Proceedings, Volume 10, Issue 7/8
How to Cite
McCluskey, P. H., Williams, R. K., Graves, R. S. and Tiegs, T. N. (1989) Thermal Diffusivity/Conductivity of Alumina-Silicon Carbide Composites, in A Collection of Papers Presented at the 13th Annual Conference on Composites and Advanced Ceramic Materials, Part 1 of 2: Ceramic Engineering and Science Proceedings, Volume 10, Issue 7/8 (ed J. B. Wachtman), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470310557.ch58
- Published Online: 26 MAR 2008
- Published Print: 1 JAN 1989
Print ISBN: 9780470374863
Online ISBN: 9780470310557
- chemical vapor deposition;
- fiber-reinforced ceramic composites;
- chemical vapor infiltration;
- high fracture toughness;
- carbon-carbon composites
The thermal diffusivity of Al2O3SiC whisker composites was measured as a function of temperature for several different compositions. It was determined that the diffusivity of the composites decreased with increasing temperature, but increased with increasing whisker content. Thermal conductivity, as calculated from diffusivity measurements, behaved similar to diffusivity. An estimate of the thermal conductivity of the silicon carbide whiskers was obtained for these materials using composite theory. Diffusivity data and the effects of thermal cycling and quenching on diffusivity will be presented.