Chapter 21. Mechanics of Crack-Tip Damage During Static and Cyclic Crack Growth in Ceramic Composites at Elevated Temperatures
- John B. Wachtman Jr.
Published Online: 28 MAR 2008
Copyright © 1989 The American Ceramic Society, Inc.
A Collection of Papers Presented at the 13th Annual Conference on Composites and Advanced Ceramic Materials, Part 2 of 2: Ceramic Engineering and Science Proceedings, Volume 10, Issue 9/10
How to Cite
Suresh, S. and Han, L. X. (1989) Mechanics of Crack-Tip Damage During Static and Cyclic Crack Growth in Ceramic Composites at Elevated Temperatures, in A Collection of Papers Presented at the 13th Annual Conference on Composites and Advanced Ceramic Materials, Part 2 of 2: Ceramic Engineering and Science Proceedings, Volume 10, Issue 9/10 (ed J. B. Wachtman), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470310588.ch21
- Published Online: 28 MAR 2008
- Published Print: 1 JAN 1989
Print ISBN: 9780470374870
Online ISBN: 9780470310588
- silicon nitride;
- ceramic matrix;
This presentation examines the mechanisms of high temperature crack growth under static and cyclic tensile loads of an Al2O3-SiC whisker composite in the temperature range 1300°–1500°C. Crack growth behavior under static and cyclic bads was characterized by da/dt vs K, and da/dN vs K plots, respectively. Detailed transmission electron microscopy of the crack-tip region, in conjunction with optical and scanning electron microscopy, are conducted to deduce the origin of permanent damage under creep conditions. Particular attention is focused on stress amplitude and mean stress effects, interfacial reactions, the flow of glassy phase, and microcrack growth along interfaces and grain boundaries. The failure behavior of reinforced ceramics is compared and contrasted with the creep crack growth characteristics of unreinforced alumina ceramic. Theoretical and experimental results of crack growth in Al2O3-SiC and Si3N4-Sic composites under cyclic compressive stresses at ambient and elevated temperatures are also discussed.