Chapter 34. Effect of Alumina Composition on Interfacial Chemistry and Strength of Direct Bonded Copper-Alumina

  1. John B. Wachtman Jr.
  1. John E. Holowczak,
  2. Victor A. Greenhut and
  3. Daniel J. Shanefield

Published Online: 28 MAR 2008

DOI: 10.1002/9780470310588.ch34

A Collection of Papers Presented at the 13th Annual Conference on Composites and Advanced Ceramic Materials, Part 2 of 2: Ceramic Engineering and Science Proceedings, Volume 10, Issue 9/10

A Collection of Papers Presented at the 13th Annual Conference on Composites and Advanced Ceramic Materials, Part 2 of 2: Ceramic Engineering and Science Proceedings, Volume 10, Issue 9/10

How to Cite

Holowczak, J. E., Greenhut, V. A. and Shanefield, D. J. (1989) Effect of Alumina Composition on Interfacial Chemistry and Strength of Direct Bonded Copper-Alumina, in A Collection of Papers Presented at the 13th Annual Conference on Composites and Advanced Ceramic Materials, Part 2 of 2: Ceramic Engineering and Science Proceedings, Volume 10, Issue 9/10 (ed J. B. Wachtman), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470310588.ch34

Author Information

  1. Center for Ceramics Research Rutgers University Piscataway, NJ

Publication History

  1. Published Online: 28 MAR 2008
  2. Published Print: 1 JAN 1989

ISBN Information

Print ISBN: 9780470374870

Online ISBN: 9780470310588

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Keywords:

  • ceramics;
  • monolithic matrir materials;
  • crack initiation stress;
  • bad-displacemenl behavior;
  • composites

Summary

The gas-metal eutectic method was used to bond copper to sintered high alumina ceramics which had different sintering aid compositions in the magnesia-cakia-silica system. The highest average copper-alumina peel adhesion strength, 205 N/cm (117 lb/in.), was observed for alumina which contained 0.2% magnesia and 0.2% calcia. The lowest peel adhesion strength, 103 N/cm (59 lb/in.), was observed for copper bonded to 95% alumina which contained magnesia, calcia, and silica additions. This bond strength was similar to that for commercial 96% alumina. Statistical matrix experiments showed that alumina containing calcium silicate had significantly lower copper bond strength. This may be attributed to the formation of a transition compound other than the copper aluminate phase identified for well bonded samples in this study.