Chapter 59. Metallization of Ceramics by IVD Method

  1. John B. Wachtman Jr.
  1. Y. Katoh,
  2. N. Sugiyama,
  3. K. Ogata and
  4. E. Kamijo

Published Online: 28 MAR 2008

DOI: 10.1002/9780470310588.ch59

A Collection of Papers Presented at the 13th Annual Conference on Composites and Advanced Ceramic Materials, Part 2 of 2: Ceramic Engineering and Science Proceedings, Volume 10, Issue 9/10

A Collection of Papers Presented at the 13th Annual Conference on Composites and Advanced Ceramic Materials, Part 2 of 2: Ceramic Engineering and Science Proceedings, Volume 10, Issue 9/10

How to Cite

Katoh, Y., Sugiyama, N., Ogata, K. and Kamijo, E. (1989) Metallization of Ceramics by IVD Method, in A Collection of Papers Presented at the 13th Annual Conference on Composites and Advanced Ceramic Materials, Part 2 of 2: Ceramic Engineering and Science Proceedings, Volume 10, Issue 9/10 (ed J. B. Wachtman), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470310588.ch59

Author Information

  1. Nissin Electric Co., Ltd. Kyoto, Japan

Publication History

  1. Published Online: 28 MAR 2008
  2. Published Print: 1 JAN 1989

ISBN Information

Print ISBN: 9780470374870

Online ISBN: 9780470310588

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Keywords:

  • celsian glass composition;
  • heraclesian phuse;
  • barium aluminosilicates;
  • glass ceramic processing;
  • heat treatments

Summary

Ion beam mixing technology at metal/ceramic interface was successfully applied to the metallization of ceramic substrates using IVD (Ion Vapor Deposion) method. IVD system combines vacuum deposition and ion implantation. The metal vaporized by an electron beam was deposited onto the ceramic surface which was irradiated with argon ions (acceleration voltage >20kV and dose >1017/cm2) at the same time. Copper depositions on alumina and aluminum nitride were realized by this method at room temperature with adhesion higher than 6 leg/mm2. The metallizing process is not affected by thermal-expansion mismatches between the metal and ceramics. Effects of the heat treatment on the adhesion will be discussed.