Chapter 11. Joining Nitride Ceramics

  1. John B. Wachtman Jr.
  1. A. P. Tomsia1,
  2. J. A. Pask1 and
  3. R. E. Loehman2

Published Online: 26 MAR 2008

DOI: 10.1002/9780470312568.ch11

Proceedings of the International Forum on Structural Ceramics Joining: Ceramic Engineering and Science Proceedings, Volume 10, Issue 11/12

Proceedings of the International Forum on Structural Ceramics Joining: Ceramic Engineering and Science Proceedings, Volume 10, Issue 11/12

How to Cite

Tomsia, A. P., Pask, J. A. and Loehman, R. E. (2008) Joining Nitride Ceramics, in Proceedings of the International Forum on Structural Ceramics Joining: Ceramic Engineering and Science Proceedings, Volume 10, Issue 11/12 (ed J. B. Wachtman), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470312568.ch11

Author Information

  1. 1

    Pask Research and Engineering Berkeley, CA 94701

  2. 2

    Sandia National Laboratories Albuquerque, NM 87185

Publication History

  1. Published Online: 26 MAR 2008
  2. Published Print: 1 JAN 1989

ISBN Information

Print ISBN: 9780470374887

Online ISBN: 9780470312568

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Keywords:

  • nitride ceramics;
  • sessile drop aperiments;
  • diffractions;
  • nitride ceramics;
  • chemical bonding

Summary

Active metal brazing of nitride ceramics (Si3N4, Si3N4 · wt% Y2O3 Si2N2O, AlN) was investigated using pure metals Cu, Sn, At, Ag-Cu eutectic alloy, and commercial brazing alloys based on the Cu-Ag-Ti system. Sessile drop experiments were performed at 900°-1150°C under 2.0 · 10–4 Pa vacuum for 60 min. The sequence of reaction products at the interface was determined by SEM/EDS, electron microprobe, and X-ray diffraction analysis. Cu-Ag eutectic (Cusil) and Sn did not react with any of the nitride ceramics. Thus no wetting or chemical bonding occurred. Cusil with additions of Ti reacted chemically with all nitride ceramics to cause wetting and chemical bonding. Copper, at 1150°C, did not wet any of the nitride ceramics and it adhered strongly only to Si3N4. At 900°C, Al wetted Si3N4 and Si3N4 · 8Y2O3 and adhered strongly to all of the nitride specimens. At 1000°C, however, Al also wetted AlN and Si2N2O after many hours of exposure. Examination of polished cross-sections in all of these causes did not show any discernible reactions.