Chapter 12. Wetting of Silicon Nitride with Selected Metals and Alloys

  1. John B. Wachtman Jr.
  1. Lennart Ljungberg and
  2. Richard Warren

Published Online: 26 MAR 2008

DOI: 10.1002/9780470312568.ch12

Proceedings of the International Forum on Structural Ceramics Joining: Ceramic Engineering and Science Proceedings, Volume 10, Issue 11/12

Proceedings of the International Forum on Structural Ceramics Joining: Ceramic Engineering and Science Proceedings, Volume 10, Issue 11/12

How to Cite

Ljungberg, L. and Warren, R. (1989) Wetting of Silicon Nitride with Selected Metals and Alloys, in Proceedings of the International Forum on Structural Ceramics Joining: Ceramic Engineering and Science Proceedings, Volume 10, Issue 11/12 (ed J. B. Wachtman), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470312568.ch12

Author Information

  1. Department of Engineering Metals Chalmers University of Technology S-412 96 Göteborg Sweden

Publication History

  1. Published Online: 26 MAR 2008
  2. Published Print: 1 JAN 1989

ISBN Information

Print ISBN: 9780470374887

Online ISBN: 9780470312568

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Keywords:

  • alloys;
  • wetting;
  • low-expansion;
  • chemical stability;
  • enamelling

Summary

The wetting of silicon nitride with the pure metals Ag, At, Au, Cu, In, and Sn as well as selected alloys of these with each other and with Mn, Si, and Ti were studied. Apart from At, the pure metals exhibit poor wetting and bonding on the nitride. As little as 2 wt% Ti was found to be active in promoting wetting and bonding of silicon nitride by the Ag-28 wt% Cu eutectic. This alloy also exhibited good wetting on the low-expansion alloy IN 909, although the spreading rate was slower.