Chapter 12. Wetting of Silicon Nitride with Selected Metals and Alloys
- John B. Wachtman Jr.
Published Online: 26 MAR 2008
Copyright © 1989 The American Ceramic Society, Inc.
Proceedings of the International Forum on Structural Ceramics Joining: Ceramic Engineering and Science Proceedings, Volume 10, Issue 11/12
How to Cite
Ljungberg, L. and Warren, R. (1989) Wetting of Silicon Nitride with Selected Metals and Alloys, in Proceedings of the International Forum on Structural Ceramics Joining: Ceramic Engineering and Science Proceedings, Volume 10, Issue 11/12 (ed J. B. Wachtman), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470312568.ch12
- Published Online: 26 MAR 2008
- Published Print: 1 JAN 1989
Print ISBN: 9780470374887
Online ISBN: 9780470312568
- chemical stability;
The wetting of silicon nitride with the pure metals Ag, At, Au, Cu, In, and Sn as well as selected alloys of these with each other and with Mn, Si, and Ti were studied. Apart from At, the pure metals exhibit poor wetting and bonding on the nitride. As little as 2 wt% Ti was found to be active in promoting wetting and bonding of silicon nitride by the Ag-28 wt% Cu eutectic. This alloy also exhibited good wetting on the low-expansion alloy IN 909, although the spreading rate was slower.