Chapter 14. Interfacial Reactions in Metal-Si3N4 Bonding

  1. John B. Wachtman Jr.
  1. R. K. Brow and
  2. R. E. Loehman

Published Online: 26 MAR 2008

DOI: 10.1002/9780470312568.ch14

Proceedings of the International Forum on Structural Ceramics Joining: Ceramic Engineering and Science Proceedings, Volume 10, Issue 11/12

Proceedings of the International Forum on Structural Ceramics Joining: Ceramic Engineering and Science Proceedings, Volume 10, Issue 11/12

How to Cite

Brow, R. K. and Loehman, R. E. (1989) Interfacial Reactions in Metal-Si3N4 Bonding, in Proceedings of the International Forum on Structural Ceramics Joining: Ceramic Engineering and Science Proceedings, Volume 10, Issue 11/12 (ed J. B. Wachtman), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470312568.ch14

Author Information

  1. Sandia National Laboratories Albuquerque, NM 87185 Norton Co., Worcester, MA.

Publication History

  1. Published Online: 26 MAR 2008
  2. Published Print: 1 JAN 1989

ISBN Information

Print ISBN: 9780470374887

Online ISBN: 9780470312568

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Keywords:

  • X-ray phtoelectron spectroscopy (XPS);
  • reactive metals;
  • segregates;
  • metal brazes;
  • interfacial

Summary

X-ray photoelectron spectroscopy (XPS) has been used to characterize the interfacial products that form by high temperature reactions between silicon nitride and two reactive metals. Al2O3 forms at Al/Si3N4 interfaces reacted at lower temperatures (800°-850°C), while AlN forms at higher temperatures (1000°C). Titanium segregates from a commercial Cu-Ag-1.5% Ti brazing alloy to the Si3N4 interface to react and form titanium nitride and possibly titanium silicide.