Chapter 14. Interfacial Reactions in Metal-Si3N4 Bonding
- John B. Wachtman Jr.
Published Online: 26 MAR 2008
Copyright © 1989 The American Ceramic Society, Inc.
Proceedings of the International Forum on Structural Ceramics Joining: Ceramic Engineering and Science Proceedings, Volume 10, Issue 11/12
How to Cite
Brow, R. K. and Loehman, R. E. (1989) Interfacial Reactions in Metal-Si3N4 Bonding, in Proceedings of the International Forum on Structural Ceramics Joining: Ceramic Engineering and Science Proceedings, Volume 10, Issue 11/12 (ed J. B. Wachtman), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470312568.ch14
- Published Online: 26 MAR 2008
- Published Print: 1 JAN 1989
Print ISBN: 9780470374887
Online ISBN: 9780470312568
- X-ray phtoelectron spectroscopy (XPS);
- reactive metals;
- metal brazes;
X-ray photoelectron spectroscopy (XPS) has been used to characterize the interfacial products that form by high temperature reactions between silicon nitride and two reactive metals. Al2O3 forms at Al/Si3N4 interfaces reacted at lower temperatures (800°-850°C), while AlN forms at higher temperatures (1000°C). Titanium segregates from a commercial Cu-Ag-1.5% Ti brazing alloy to the Si3N4 interface to react and form titanium nitride and possibly titanium silicide.