Chapter 24. Boundary Effects on the Interfacial Transient Thermal Fracture of Ceramic-To-Metal Bonds

  1. John B. Wachtman Jr.
  1. Klod Kokini

Published Online: 26 MAR 2008

DOI: 10.1002/9780470312568.ch24

Proceedings of the International Forum on Structural Ceramics Joining: Ceramic Engineering and Science Proceedings, Volume 10, Issue 11/12

Proceedings of the International Forum on Structural Ceramics Joining: Ceramic Engineering and Science Proceedings, Volume 10, Issue 11/12

How to Cite

Kokini, K. (1989) Boundary Effects on the Interfacial Transient Thermal Fracture of Ceramic-To-Metal Bonds, in Proceedings of the International Forum on Structural Ceramics Joining: Ceramic Engineering and Science Proceedings, Volume 10, Issue 11/12 (ed J. B. Wachtman), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470312568.ch24

Author Information

  1. Purdue University School of Mechanical Engineering West Lafayette, IN 47907

Publication History

  1. Published Online: 26 MAR 2008
  2. Published Print: 1 JAN 1989

ISBN Information

Print ISBN: 9780470374887

Online ISBN: 9780470312568

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Keywords:

  • difformation;
  • ceramic-to-metal bond;
  • transient;
  • thermal;
  • mechanical

Summary

The effect of a transient thermal load on the deformations and strain energy release rates was analyzed for a ceramic-to-metal bond containing a crack at the interface. The results were calculated for cases where the boundary of the metal was (a) uninsulated, (b) insulated against heat transfer, and (c) insulated and restrained. For each case, the transient thermal load was applied to an edge-cracked and a center-cracked interface. Also, the effect of changing the thickness of the ceramic layer on the deformations and crack parameters was analyzed.