Chapter 29. Strength of Silicon Nitride-Silicon Nitride Joints Bonded with Oxynitride Glass

  1. John B. Wachtman Jr.
  1. Robert M. Neilson Jr. and
  2. Dennis N. Coon

Published Online: 26 MAR 2008

DOI: 10.1002/9780470312568.ch29

Proceedings of the International Forum on Structural Ceramics Joining: Ceramic Engineering and Science Proceedings, Volume 10, Issue 11/12

Proceedings of the International Forum on Structural Ceramics Joining: Ceramic Engineering and Science Proceedings, Volume 10, Issue 11/12

How to Cite

Neilson, R. M. and Coon, D. N. (1989) Strength of Silicon Nitride-Silicon Nitride Joints Bonded with Oxynitride Glass, in Proceedings of the International Forum on Structural Ceramics Joining: Ceramic Engineering and Science Proceedings, Volume 10, Issue 11/12 (ed J. B. Wachtman), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470312568.ch29

Author Information

  1. Idaho National Engineering Laboratory EG&G Idaho, Inc. Idaho Falls, ID 83415

Publication History

  1. Published Online: 26 MAR 2008
  2. Published Print: 1 JAN 1989

ISBN Information

Print ISBN: 9780470374887

Online ISBN: 9780470312568

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Keywords:

  • oxynitride;
  • morphology;
  • metallic components;
  • complex geometries;
  • brazing

Summary

The use of oxynitride glasses in the Y-Si-Al-O-N system to join sintered silicon nitride was investigated. Flexural strength of joined silicon nitride was dependent upon joining temperature, joint morphology, and joining glass composition. Non- brittle behavior was observed at test temperatures of 1100°C or higher with joint morphologies characterized by thick glass layers (40–50 μm). In contrast, brittle behavior was observed to test temperatures of 1300°C with joint morphologies characterized by thin glass layers (<5 μm). Joint strengths comparable to the strength of as-received silicon nitride were observed to test temperatures as high as 1100°C. Oxidation of the fracture surfaces was observed at lest temperatures of 1300°C and higher.