Chapter 6. Intrusion Bonding of Nickel and Zirconia

  1. John B. Wachtman Jr.
  1. I. E. Reimanis,
  2. S. L. Shinde and
  3. L. C. Dejonghe

Published Online: 26 MAR 2008

DOI: 10.1002/9780470312568.ch6

Proceedings of the International Forum on Structural Ceramics Joining: Ceramic Engineering and Science Proceedings, Volume 10, Issue 11/12

Proceedings of the International Forum on Structural Ceramics Joining: Ceramic Engineering and Science Proceedings, Volume 10, Issue 11/12

How to Cite

Reimanis, I. E., Shinde, S. L. and Dejonghe, L. C. (2008) Intrusion Bonding of Nickel and Zirconia, in Proceedings of the International Forum on Structural Ceramics Joining: Ceramic Engineering and Science Proceedings, Volume 10, Issue 11/12 (ed J. B. Wachtman), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470312568.ch6

Author Information

  1. Lawrence Berkeley Laboratory Materials and Chemical Sciences Division Department of Materials Science and Mineral Engineering University of California Berkeley, CA 94720

Publication History

  1. Published Online: 26 MAR 2008
  2. Published Print: 1 JAN 1989

ISBN Information

Print ISBN: 9780470374887

Online ISBN: 9780470312568

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Keywords:

  • intrusion bonding;
  • micrometers;
  • metallceramic inteface;
  • micro-indentation tests;
  • thermal barrier

Summary

Intrusion bonding of nickel to zirconia was achieved by hot pressing the zirconia powder onto Ni sheet, at pressures of about 55 MN/m2, and temperatures of about 1573 K. The intrusion zone can be several hundred micrometers thick, providing a gradual transition from ceramic to metal The most extensive intrusion occurred when pressure was applied late in the heating cycle, after the zirconia powder had coarsened. The parameters determining the extent of the intrusion bonding are discussed. The intrusion bonds are compared to diffusion bonds for which a discrete metal/ceramic interface was maintained. Vickers micro-indentation tests in the intrusion bond zone indicated that metal intrusion provided improved bonding.