Chapter 7. Alumina-Copper Diffusion Bonding
- John B. Wachtman Jr.
Published Online: 26 MAR 2008
Copyright © 1989 The American Ceramic Society, Inc.
Proceedings of the International Forum on Structural Ceramics Joining: Ceramic Engineering and Science Proceedings, Volume 10, Issue 11/12
How to Cite
Crispin, R. M. and Nicholas, M. G. (1989) Alumina-Copper Diffusion Bonding, in Proceedings of the International Forum on Structural Ceramics Joining: Ceramic Engineering and Science Proceedings, Volume 10, Issue 11/12 (ed J. B. Wachtman), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470312568.ch7
- Published Online: 26 MAR 2008
- Published Print: 1 JAN 1989
Print ISBN: 9780470374887
Online ISBN: 9780470312568
- post-fabricatwn treatments;
- tensile strengths;
- ceramic-metal systems;
This paper presents a case study of the variations in fabrication procedures and post-fabrication treatments as applied to alumina-copper joints made by diffusion bonding. The effects of fabrication temperature, fabrication time, environment, pressing time, and pressure are discussed, as are the effects of cooling rate and post-fabrication stress relief anneals. Careful selection of fabrication conditions and post-fabrication treatments improves room temperature joint tensile strengths of ASTM (F.19) test piece samples from ∼10 MN/m-2 to > 80 MN/m−2, despite the marked thermal contraction mismatch between the metal and the ceramic.