Chapter 7. Alumina-Copper Diffusion Bonding

  1. John B. Wachtman Jr.
  1. R. M. Crispin and
  2. M. G. Nicholas

Published Online: 26 MAR 2008

DOI: 10.1002/9780470312568.ch7

Proceedings of the International Forum on Structural Ceramics Joining: Ceramic Engineering and Science Proceedings, Volume 10, Issue 11/12

Proceedings of the International Forum on Structural Ceramics Joining: Ceramic Engineering and Science Proceedings, Volume 10, Issue 11/12

How to Cite

Crispin, R. M. and Nicholas, M. G. (1989) Alumina-Copper Diffusion Bonding, in Proceedings of the International Forum on Structural Ceramics Joining: Ceramic Engineering and Science Proceedings, Volume 10, Issue 11/12 (ed J. B. Wachtman), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470312568.ch7

Author Information

  1. Materials Development Division Harwell Laboratory Didcot, Oxon, OX11 ORA U.K.

Publication History

  1. Published Online: 26 MAR 2008
  2. Published Print: 1 JAN 1989

ISBN Information

Print ISBN: 9780470374887

Online ISBN: 9780470312568

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Keywords:

  • post-fabricatwn treatments;
  • tensile strengths;
  • ASTM;
  • ceramic-metal systems;
  • diffusion

Summary

This paper presents a case study of the variations in fabrication procedures and post-fabrication treatments as applied to alumina-copper joints made by diffusion bonding. The effects of fabrication temperature, fabrication time, environment, pressing time, and pressure are discussed, as are the effects of cooling rate and post-fabrication stress relief anneals. Careful selection of fabrication conditions and post-fabrication treatments improves room temperature joint tensile strengths of ASTM (F.19) test piece samples from ∼10 MN/m-2 to > 80 MN/m−2, despite the marked thermal contraction mismatch between the metal and the ceramic.