Chapter 38. Effect of Substrate and Pretreatment on Copper to AIN Direct Bonds

  1. John B. Wachtman Jr
  1. W. L. Chiang,
  2. V. A. Greenhut,
  3. D. J. Shanefield,
  4. L. Salvati and
  5. R. L. Moore

Published Online: 26 MAR 2008

DOI: 10.1002/9780470313848.ch38

Proceedings of the 15th Annual Conference on Composites and Advanced Ceramic Materials, Part 2 of 2: Ceramic Engineering and Science Proceedings, Volume 12, Issue 9/10

Proceedings of the 15th Annual Conference on Composites and Advanced Ceramic Materials, Part 2 of 2: Ceramic Engineering and Science Proceedings, Volume 12, Issue 9/10

How to Cite

Chiang, W. L., Greenhut, V. A., Shanefield, D. J., Salvati, L. and Moore, R. L. (1991) Effect of Substrate and Pretreatment on Copper to AIN Direct Bonds, in Proceedings of the 15th Annual Conference on Composites and Advanced Ceramic Materials, Part 2 of 2: Ceramic Engineering and Science Proceedings, Volume 12, Issue 9/10 (ed J. B. Wachtman), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470313848.ch38

Author Information

  1. Department of Ceramics, College of Engineering, Rutgers University, Piscataway, NJ 08855-0909

Publication History

  1. Published Online: 26 MAR 2008
  2. Published Print: 1 JAN 1991

ISBN Information

Print ISBN: 9780470375105

Online ISBN: 9780470313848

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