Chapter 47. Anelastic Recovery in Crept Silicon Nitride
- John B. Wachtman Jr.
Published Online: 26 MAR 2008
Copyright © 1992 The American Ceramics Society
Proceedings of the 16th Annual Conference on Composites and Advanced Ceramic Materials, Part 2 of 2: Ceramic Engineering and Science Proceedings, Volume 13, Issue 9/10
How to Cite
Haig, S., Cannon, W. R. and Whalen, P. J. (1994) Anelastic Recovery in Crept Silicon Nitride, in Proceedings of the 16th Annual Conference on Composites and Advanced Ceramic Materials, Part 2 of 2: Ceramic Engineering and Science Proceedings, Volume 13, Issue 9/10 (ed J. B. Wachtman), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470313978.ch47
- Published Online: 26 MAR 2008
- Published Print: 1 JAN 1994
Print ISBN: 9780470375198
Online ISBN: 9780470313978
- intermetallic compound;
- thermal expansion
Two silicon nitride materials of the same composition but different microstructures were crept in tension using an apparatus with pneumatic loading and laser extensometry. The coarse grained material had significantly greater creep resistance. The anelastic behavior of these two materials after removal of the load during a creep run was studied. Strain recoveries of up to 40% have been observed in the time range of 10 to 30 hours after load removal at the test temperature. The magnitude of the viscoelastic strain recovery was dependent on the amount of pre-strain present at the time of load removal in both materials. A generalized Voigt model of viscoelastic response can be used to interpret the effects of grain size, accumulated strain, and strain rate on the anelastic response in these silicon nitride materials.