Chapter 35. Predicting Creep Behavior of Silicon Nitride Components Using Finite Element Techniques
- John B. Wachtman Jr.
Published Online: 28 MAR 2008
Copyright © 1993 The American Ceramic Society
Proceedings of the 17th Annual Conference on Composites and Advanced Ceramic Materials, Part 1 of 2: Ceramic Engineering and Science Proceedings, Volume 14, Issue 7/8
How to Cite
Wade, J. A., White, C. S. and Wu, F. J. (1993) Predicting Creep Behavior of Silicon Nitride Components Using Finite Element Techniques, in Proceedings of the 17th Annual Conference on Composites and Advanced Ceramic Materials, Part 1 of 2: Ceramic Engineering and Science Proceedings, Volume 14, Issue 7/8 (ed J. B. Wachtman), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470314180.ch35
- Published Online: 28 MAR 2008
- Published Print: 1 JAN 1993
Print ISBN: 9780470375266
Online ISBN: 9780470314180
- silicon nitride;
- Arrhenius' law;
The creep of silicon nitride tensile specimens has been modeled and incorporated into finite element software to predict the behavior of structural components. The experimental results are for the creep deformation of HIPed yttria-doped silicon nitride at temperatures up to 1400°C. Results are for both homogeneous and joined specimens. This experimental database was modeled using two approaches: Arrhenius' law representation of the steady-state phase, and theta projection method representation of both primary and secondary stages. Arrhenius' law has been incorporated into commercial finite element software and used to predict the creep deformation behavior and time to failure for a simulated component represented by a notched tensile specimen.