Chapter 14. Gas-Metal Eutectic Bonded Cu TO Al2O3 Substrate-Mechanism and Substrate Additives Effect Study

  1. John B. Wachtman Jr.
  1. Wan-Lan Chiang1,
  2. Victor A. Greenhut1,
  3. Daniel J. Shanefield1,
  4. Lois A. Johnson1 and
  5. Richard L. Moore2

Published Online: 26 MAR 2008

DOI: 10.1002/9780470314234.ch14

Proceedings of the 17th Annual Conference on Composites and Advanced Ceramic Materials, Part 2 of 2: Ceramic Engineering and Science Proceedings, Volume 14, Issue 9/10

Proceedings of the 17th Annual Conference on Composites and Advanced Ceramic Materials, Part 2 of 2: Ceramic Engineering and Science Proceedings, Volume 14, Issue 9/10

How to Cite

Chiang, W.-L., Greenhut, V. A., Shanefield, D. J., Johnson, L. A. and Moore, R. L. (1993) Gas-Metal Eutectic Bonded Cu TO Al2O3 Substrate-Mechanism and Substrate Additives Effect Study, in Proceedings of the 17th Annual Conference on Composites and Advanced Ceramic Materials, Part 2 of 2: Ceramic Engineering and Science Proceedings, Volume 14, Issue 9/10 (ed J. B. Wachtman), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470314234.ch14

Author Information

  1. 1

    Department of Ceramic Engineering Rutgers University, Piscataway, NJ 08855

  2. 2

    Evans East, Plainsboro, NJ 08536

Publication History

  1. Published Online: 26 MAR 2008
  2. Published Print: 1 JAN 1993

ISBN Information

Print ISBN: 9780470375273

Online ISBN: 9780470314234

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Keywords:

  • mechanism;
  • eutectic phase diagram;
  • polycrystalline;
  • modification;
  • moly-manganese

Summary

Cu was gas-metal eutectic bonded to 96%, 99.6% electronic grade Al2O3 substrates and sapphire crystals. The average peel strengths were 98, 98 and 56 N/cm, respectively (average standard deviation ±7 N/cm).

Chemical reaction was determined to be the major bonding mechanism. The two phases predicted by the eutectic phase diagram, CU2O and Cu(a), formed as a lamellar structure when the molten Cu-O cooled. The strong bond was formed mainly by distributed Cu2O dendrites at the interface. A copper aluminate reaction product existed between Cu2O eutectic dendrites and Al2O3. The specific copper aluminate phase differed depending upon substrate. CuAl2O4 formed on the commercial polycrystalline substrates, while CuAlO2 was found in the case of sapphire. This difference may result from trace elements in the polycrystalline material.

No interaction phase was detected between Cu(α) and sapphire. However, Cu-O eutectic melt dissolved the grain boundary constituents (MgO, CaO & SiO2 etc.) in the polycrystalline substrates. On cooling, fine mixed oxide crystals formed at Al2O3 grain boundaries as well as a thin film transition zone between Cu(a) and Al2O3. The higher peel strength associated with polycrystalline Al2O3 substrates may be attributed to minor chemical modification at the interfaces and/or a mechanical anchoring effect.