Chapter 6. Effects of Oxidation and Creep Damage Mechanisms on Creep Rupture Behavior in Hiped Silicon Nitrides
- John B. Wachtman Jr.
Published Online: 28 MAR 2008
Copyright © 1994 The American Ceramic Society
Proceedings of the 18th Annual Conference on Composites and Advanced Ceramic Materials - A: Ceramic Engineering and Science Proceedings, Volume 15, Issue 4
How to Cite
Wereszczak, A. A., Ferber, M. K. and Kirkland, T. P. (2008) Effects of Oxidation and Creep Damage Mechanisms on Creep Rupture Behavior in Hiped Silicon Nitrides, in Proceedings of the 18th Annual Conference on Composites and Advanced Ceramic Materials - A: Ceramic Engineering and Science Proceedings, Volume 15, Issue 4 (ed J. B. Wachtman), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470314500.ch6
- Published Online: 28 MAR 2008
- Published Print: 1 JAN 1994
Print ISBN: 9780470375327
Online ISBN: 9780470314500
The creep resistance of hot-isostatically pressed (HIPed) silicon nitride materials is ultimately dictated by its susceptibility to creep enhanced damage (e.g. cavitation) and oxidation induced damage. The evolution of these simultaneously occurring events has been examined in several HIPed silicon nitrides which were tested in tension at elevated temperatures. The activity and extent of each have been found to be functions of several variables. These parameters and their roles are discussed and include the following: the initial oc/p ratio of silicon nitride grains, reaction of stable/unstable phases in the as-received material, the percentage and type of sintering aid, and grain boundary crystallinity, impurity content, and viscosity.