Chapter 2. Elevated Temperature Slow Crack Growth of Silicon Nitride Under Dynamic, Static and Cyclic Flexural Loading

  1. John B. Wachtman Jr.
  1. Sung R. Choi1,
  2. Jonathan A. Salem2,
  3. Noel Nemeth2 and
  4. John P. Gyekenyesi2

Published Online: 28 MAR 2008

DOI: 10.1002/9780470314555.ch2

Proceedings of the 18th Annual Conference on Composites and Advanced Ceramic Materials - B: Ceramic Engineering and Science Proceedings, Volume 15, Issue 5

Proceedings of the 18th Annual Conference on Composites and Advanced Ceramic Materials - B: Ceramic Engineering and Science Proceedings, Volume 15, Issue 5

How to Cite

Choi, S. R., Salem, J. A., Nemeth, N. and Gyekenyesi, J. P. (1994) Elevated Temperature Slow Crack Growth of Silicon Nitride Under Dynamic, Static and Cyclic Flexural Loading, in Proceedings of the 18th Annual Conference on Composites and Advanced Ceramic Materials - B: Ceramic Engineering and Science Proceedings, Volume 15, Issue 5 (ed J. B. Wachtman), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470314555.ch2

Author Information

  1. 1

    Cleveland State University, Cleveland, OH 44115

  2. 2

    NASA Lewis Research Center, Cleveland, OH 44135

Publication History

  1. Published Online: 28 MAR 2008
  2. Published Print: 1 JAN 1994

ISBN Information

Print ISBN: 9780470375334

Online ISBN: 9780470314555

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