Chapter 61. Microwave Plasma Etching of Si3N4

  1. John B. Wachtman Jr.
  1. Vincent A. Knapp1,
  2. Dale E. Wittmer1,
  3. Josep H. J. Conover1 and
  4. Charles W. Miller Jr.2

Published Online: 28 MAR 2008

DOI: 10.1002/9780470314555.ch61

Proceedings of the 18th Annual Conference on Composites and Advanced Ceramic Materials - B: Ceramic Engineering and Science Proceedings, Volume 15, Issue 5

Proceedings of the 18th Annual Conference on Composites and Advanced Ceramic Materials - B: Ceramic Engineering and Science Proceedings, Volume 15, Issue 5

How to Cite

Knapp, V. A., Wittmer, D. E., Conover, J. H. J. and Miller, C. W. (1994) Microwave Plasma Etching of Si3N4, in Proceedings of the 18th Annual Conference on Composites and Advanced Ceramic Materials - B: Ceramic Engineering and Science Proceedings, Volume 15, Issue 5 (ed J. B. Wachtman), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470314555.ch61

Author Information

  1. 1

    Department of Mechanical Engineering Southern Illinois University, Carbondale, IL 62901

  2. 2

    Centorr Furnaces/Vacuum Industries Nashua, NH 03063

Publication History

  1. Published Online: 28 MAR 2008
  2. Published Print: 1 JAN 1994

ISBN Information

Print ISBN: 9780470375334

Online ISBN: 9780470314555

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Keywords:

  • microwave plasma etching techniques;
  • microwave plasma variables;
  • microwave power;
  • percent plasma pulse;
  • chemical and thermal etching procedures

Summary

The goal of this work was to develop microwave plasma etching techniques for selected Si3N4 compositions. The microwave plasma variables studied were microwave power, percent plasma pulse, etching time and ratio of CF4 to O2 Conditions were identified for obtaining a high quality etch for Si3N4 containing Al2O3 Y2O3 and La2 O3 The benefits of plasma etching Si3N4, compared with chemical and thermal etching procedures include: quality of etch, high reproducibility, and no undesirable alteration of the microstructure. The advantage of microwave plasma etching compared to r.f plasma etching is primarily shorter etching times, resulting in a more cost effective technique.<./i>