Chapter 11. Fine-Grind Cullet Technology, Part 1: Application of Differential Grinding for Fine cullet Production and Contaminant Removal

  1. John B. Wachtman Jr
  1. Damian E. Rodriguez

Published Online: 26 MAR 2008

DOI: 10.1002/9780470314661.ch11

A Collection of Papers Presented at the 55th Conference on Glass Problems: Ceramic Engineering and Science Proceedings, Volume 16, Issue 2

A Collection of Papers Presented at the 55th Conference on Glass Problems: Ceramic Engineering and Science Proceedings, Volume 16, Issue 2

How to Cite

Rodriguez, D. E. (1995) Fine-Grind Cullet Technology, Part 1: Application of Differential Grinding for Fine cullet Production and Contaminant Removal, in A Collection of Papers Presented at the 55th Conference on Glass Problems: Ceramic Engineering and Science Proceedings, Volume 16, Issue 2 (ed J. B. Wachtman), John Wiley & Sons, Inc., Hoboken, NJ, USA. doi: 10.1002/9780470314661.ch11

Author Information

  1. REMco, Inc., Livermore, CA

Publication History

  1. Published Online: 26 MAR 2008
  2. Published Print: 1 JAN 1995

ISBN Information

Print ISBN: 9780470375358

Online ISBN: 9780470314661

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Keywords:

  • contaminants;
  • efficiency;
  • revolution;
  • friability;
  • ceramic

Summary

The drive for continuous quality improvement at Owens-Brockway is of paramount priority. To accomplish this, the quality of raw materials used in the container manufacturing process, specifically recycled glass, must be improved. The development of fine-grind cullet technology is one method proven to be successful in removing contaminants typically present in cullet. This paper will describe improved differential grinding technology, its background, how it works, and how its application in the GlassMax system produces fine cullet and facilitates the removal of contaminants. The results of fine-grind cullet plant trials will be presented. These trials have shown fine-grind cullet to be a means of improving cullet quality, but new issues regarding processing and handling of the cullet must be addressed.